Zymet, Inc

UV Curable Glob Top and Dam-and-Fill Encapsulants

For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cu...

Materials

Ultra-low Stress Die Attach Adhesives

For bonding of stress sensitive devices In microelectronics assembly, adhesives are most often used to bond dissimilar materials with mismatched coefficients of thermal expansion. As a consequence, the bonded parts bend at temperat...

Materials

Optoelectronics Adhesives

Zymet's optoelectronics adhesives are designed for applications such as fiber assembly, connector or ferrule assembly, VCSEL assembly, Bragg Grating assembly, and many others. The adhesives offer the following features:...

Materials

Non-Conductive Pastes (NCP)

For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can als...

Materials

Thermally Conductive Adhesives

For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resista...

Materials

Electrically Conductive Adhesives

For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC as...

Materials

Anisotropically Conductive Adhesives

For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-...

Materials

Underfill Encapsulants for Flip Chips

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size...

Materials

Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4

Feb 08, 2013 | Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.

New Underfill from Zymet for 0.4-mm pitch POP's

Jan 13, 2012 | Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Apr 07, 2011 | Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Low CTE Reworkable Underfill for Superior Thermal Cycle Performance

Mar 17, 2010 | EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.

Reworkable Underfill for Package-on-Package (POP)

Sep 17, 2009 | EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.

Reworkable Underfill Encapsulant for BGA's

Apr 27, 2004 | Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.

Reworkable Underfill Encapsulant for CSP's and BGA's

Sep 25, 2003 | Reduce waste and cost.