Hi-Rel Alloys Ltd
manufactures solder preforms , hermetic covers , heat spreaders and custom welded assembllies
Comprehensive producer of alloys for the Microelectronics Industry. Capabilities include casting , rolling , stamping , machining , and tack welding. Common low temperature alloys are Tin / Lead , Gold / Tin , and Silver. Materials available in sheet , stamped preforms, and machined forms. Products include thermal management materials such as Copper , Molbdenum and Aluminum. Unique capability for providing prototype custom alloys of all sizes without hard tooling costs.
Hi-Rel Alloys Ltd Postings
3 products »
Preforms are used for specialty component attach and die / substrate attach for device makers....
Metal Covers are usually Kovar plated with Ni/Au. Covers are sealed to a ceramic or metal package, achieving a hermetic enclosure....
typically Cu or Cu/Mo/Cu stampings used to cool GaAs chips or as inserts in platic packages....
