KSW Microtec

Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)

Consultant / Service Provider

This company is no longer in business.

Interconnection Technologies, Advanced Packaging, Adhesive Flip-Chip Assembly, Interconnection Technology Development, Technology Transfer and Training, Assembly Services, Smart Card Packaging, Smart Label Packaging, High Volume Production, Wafer Bumping & Plating Service (NiAu, Pd...), Fine-Pitch-Track Printing, Chip-on-Board / Chip-on-Flex, Sensor Packaging, Transponder-Identification Systems, Low Cost Applications, Underfilling, Reliability Tests

Please contact us to discuss you specific requirements. We will find a solution for you!

KSW Microtec Postings

3 products »

Adhesive Flip Chip Technologies

Technology Development...

Bumping Services

Technology Development and Bumping...

Assembly Services

Prototyping to High Volume Assembly...

One stop service for all SMT and PCB needs

pressure curing ovens