Cost Effective Rework of Medium Size Boards
The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum of SMD components, ranging ...
|
Rework & Repair Equipment |
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.
The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps...
|
Rework & Repair Equipment |
Future in Advanced Rework.
The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy.
With a high level of process modularit...
|
Rework & Repair Equipment |
The new MiniOven-05 is a compact and versatile IR reflow oven suitable for a wide range of SMD components. This newest version provides enhanced process capability with updated firmware and increased control and temperature stability.
The highly efficient hybrid heating technology heats...
|
Rework & Repair Equipment |
Dispensing varied materials across a wide range of viscosities – using the same equipment! Especially solder paste and other filled media have always been particularly demanding when reliable and consistent results are expected. The Clever Dispense equipment family offer the optimum solutio...
|
Rework & Repair Equipment |
The compact and flexible IR underheater HOTBEAM is the ideal supplement to a FINEPLACER® rework station. With modest space requirements and an overall height of only 40 mm, the IR underheater can be accommodated on every working table while providing very ergonomic operation. In...
|
Rework & Repair Equipment |
Automated Prototype2Production Bonder.
The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protected from external influences...
|
IC Packaging |
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications.
The system offers outstan...
|
IC Packaging |
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.
This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding. Des...
|
IC Packaging |
Bonding forces up to 700 N with outstanding coplanarity.
As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications.
Today's ACF challenges are often c...
|
IC Packaging |