SinkPAD Corporation

Our patent pending SinkPAD™ technology is a PCB technology that makes it possible to conduct heat out of the LED system and into the atmosphere at a much greater rate.

SinkPAD™ technology will improve any LED application, but it will be most effective in high power (HP) & high bright (HB) surface mount LED systems, especially those that are currently not effective enough at dissipating heat to be viable. SinkPAD enables direct thermal path between LED and surrounding atmosphere. SinkPAD is cost competitive in almost all cases, but in applications with active cooling systems that are able to switch to passive cooling systems because of SinkPAD™ it is more than just competitive; it is in a league of its own.  Any LED application that requires active cooling can reduce its reliance on the increased costs and moving parts involved even if it cannot be completely eliminated.  This is always a good thing, and often times, as an indirect effect the size of the devices in these applications can also be reduced because of smaller or now non-existent active cooling systems making these devices cheaper to make and more desirable to the consumer.

SinkPAD™ technology benefits:

• 135 W/m.k. – 385 W/m.k. heat transfer rate
• Direct thermal path
• Lower junction temperature
• Lowest thermal resistance
• Higher operating temperature (Up to 225 degree Celsius)
• Thin profile
• Less expensive dielectrics
• Longer LED life
• Cost Competitive with Aluminum PCB (typical Metal Back PCB)
• Reduces cooling systems costs
• Ideal for surface mount LED components such as High Power & High Bright LED
• Multilayer PCB possible without increased thermal resistance