DIP automatic scissors feeder
Product Description:
Before the industry in the DIP (traditional parts plug-in) process mostly belong to the majority of human work
Procut device can replace the current DIP (traditional parts plug-in)
Production costs are re...
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Components |
Typical Applications
1.microprocessors and cache chips
2.aptop PCs and other high density, handheld portable electronics
3.high speed disk drives
Features/Benefits
1.component junction temperature reduction of 20??C is typical
2.easily added t...
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Other |
Typical Applications
1.microprocessors and cache chips
2.aptop PCs and other high density, handheld portable electronics
3.high speed disk drives
Features/Benefits
1.component junction temperature reduction of 20??C is typical
2.easily added t...
|
Other |
Typical Applications
1.microprocessors and cache chips
2.aptop PCs and other high density, handheld portable electronics
3.high speed disk drives
Features/Benefits
1.component junction temperature reduction of 20??C is typical
2.easily added t...
|
Other |
Typical Applications
1.microprocessors and cache chips
2.aptop PCs and other high density, handheld portable electronics
3.high speed disk drives
Features/Benefits
1.component junction temperature reduction of 20??C is typical
2.easily added t...
|
Other |
Typical Applications
1.microprocessors and cache chips
2.aptop PCs and other high density, handheld portable electronics
3.high speed disk drives
Features/Benefits
1.component junction temperature reduction of 20??C is typical
2.easily added t...
|
Other |
Typical Applications
1.microprocessors and cache chips
2.aptop PCs and other high density, handheld portable electronics
3.high speed disk drives
Features/Benefits
1.component junction temperature reduction of 20??C is typical
2.easily added t...
|
Other |
Product Description
Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating modules, metallic structures, and machi...
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Other |
PCH-S15 Series thermally conductive interface materialsare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal hous...
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Other |
M400 Series thermallyconductive interface materials are applied to fill the air gaps between the heatingelements and the heat dissipation fins or the metal base. Their flexibility andelasticity make them suited to the coating of the very uneven surfaces. Heatcan transmit to the metal housing o...
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Other |