SMT Equipment

Underfill FF35

Company Information:

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada


  • Phone +1-514-494-2000

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Underfill FF35

Underfill FF35


Underfill FF35



Offered by:

AIM Solder


Underfill FF35 Description:

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underfill FF35 offers superior reliability through high Tg, low CTE, good fill, no voiding, compatibility with no-clean flux residues and excellent adhesion. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds. Underfill FF35 may be reworked at 120°C (250°F). The viscosity of Underfill FF35 remains stable throughout its shelf life. This product is suitable for bare chip protection in a broad variety of small die applications.

  • Excellent Capillary Function for Fast Reflow
  • Compatible with No-Clean Flux Residues
  • Reworkable at 120° C
  • Good Storage Properties
  • No Voiding

Underfill FF35 was added in May 2015

Underfill FF35 has been viewed 932 times

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