BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.



BTU’s products excel in processes where precise control of atmosphere and temperature are critical to product yield. With over 10,000 units shipped, service and support in over 30 countries, and manufacturing facilities on two continents BTU is the leading choice for global manufacturers.


The World’s Best Performing Reflow Ovens

Pyramax OvensBTU’s Pyramax family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. The Pyramax features BTU’s exclusive closed loop convection control and process temperatures up to 400°C. For the most demanding applications Pyramax can provide O2 levels as low as 2ppm above source in the peak reflow zone.

Custom Furnaces: Made in the USA

BTU’s Controlled Atmosphere Furnace has the industry’s lowest Cost of Ownership and features process temperatures up to 1180°C. BTU’s automated thermal controls utilize segmented heaters to optimize thermal performance resulting in thermal uniformity better than +/-2°C. The system also features flexible atmosphere with Argon, Hydrogen, Nitrogen or forming gas available.

BTU International Postings

4 products »

Pyramax Vacuum Reflow Oven

Vacuum Reflow for High-Volume Manufacturing The Pyramax Vacuu...


Pyramax Vacuum Reflow Oven

Pyramax TrueFlat

NEW REFLOW OVEN TECHNOLOGY FOR SUBSTRATE FLATNESS Easy process transfer Low maintenance, no vacuum pump &l...


Pyramax TrueFlat

PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven

Eliminate reflow oven changeover time. The PYRAMAX ZeroTurn is designed for high volume electronics manufacturers who must also manage process mix and are dissatisfied with the poor process separation of other dual cham...


PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven

5 technical articles »

Operation of a Vacuum Reflow Oven with Void Reduction Data

Apr 21, 2021 | Fred Dimock

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness....

Thermal Profiles - Why Getting Them Right is Important

Oct 24, 2019 | Fred Dimock

Presentation given by Fred Dimock during a seminar at the American Competitiveness Institute, ACI. •Recipe vs. Profile •Material Properties •Why profiles are shaped like they are. •Obtaining profiles •TC Accuracy •Profilers •Test vehicles •Process Window – Eutectic vs. Lead Free •Heat transfer •Oven Control...

Lead-Free Solder Wafer Bumping

Dec 06, 2007 | Fred Dimock, Kristen Mattson.

Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition....

Making A Case for Continuous Furnaces

Nov 08, 2007 | Fred Dimock

A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace....

Maximizing Process Control with Controlled Convection Rates

Oct 10, 2007 | Rob DiMatteo, Fred Dimock, Pierre LeMieux.

Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection"....

306 news releases »

BTU Announces 'Rep of the Year' Awards Before the Start of APEX 2023

Feb 06, 2023 | BTU International, Inc. announced its 'Rep of the Year' Awards during a sales meeting and dinner on Monday, January 23, 2023, before the start of the IPC APEX EXPO. Awards were presented to SmarTsol Technologies – Rep of the Year (Mexico), Electronics Assembly Products – Sales Recognition Award (USA), and JW Corporation (Sales Recognition Award (Canada).

BTU Expands into Northern CA and NV with Assembly Resource

Dec 21, 2022 | BTU International, Inc. today announced the appointment of Assembly Resource as its new exclusive distributor for reflow soldering systems in Northern California and Northern Nevada.

BTU to Launch New iRaptor Profiling Technology at APEX 2023

Dec 14, 2022 | BTU International, Inc. is excited to announce the launch of its new profiling technology at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. As a result of the company's strategic partnership with iRaptor, BTU has developed its new iRaptor Profiling Technology that will debut for the first time at the show in Booth #2322.

BTU Partners with iRaptor to Offer Advanced Profiling Technology

Oct 20, 2022 | BTU International, Inc. today announced a new strategic partnership with iRaptor to offer thermal profiling solutions. iRaptor is a software and hardware development company providing solutions for thermal process optimization and control.

The Industry's Leading Solution for Solder Reflow Flux Management from BTU at SMTAI

Oct 06, 2022 | BTU International, Inc. today announced plans to exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. The company will feature its Aqua Scrub™ Flux Management Technology in Booth #1025.

BTU Appoints Smd-Tec as Distributor in the Benelux Region

Sep 30, 2022 | BTU International, Inc. today announced the appointment of Smd-Tec as its new exclusive distributor for reflow soldering systems in the Benelux region.

Isaiah Smith New Regional Sales Manager for BTU

Sep 26, 2022 | BTU International, Inc. is pleased to announce the appointment of Isaiah Smith as its new regional sales manager. Based out of New England, he will cover the central US, as well as Canada.

The Ultimate Flux Management Solution from BTU at SEMICON Taiwan

Sep 14, 2022 | BTU International, Inc. will exhibit at to exhibit at SEMICON Taiwan, scheduled to take place Sept. 14-16, 2022 at TaiNEX 1 in Taipei. The company will feature its Aqua Scrub™ Flux Management Technology in Booth #N1089.

BTU to Demo the PYRAMAX 125A with SMarTsol at SMTA Guadalajara

Sep 14, 2022 | BTU International, Inc. will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022 at the Expo Guadalajara in Jalisco, Mexico. The company will feature its PYRAMAX 125A in the SMarTsol Technologies booth.

ZTE Corporation Sees Significant Savings Using BTU Reflow Ovens with Energy Pilot

Sep 14, 2022 | BTU International, Inc. today announced that ZTE Corporation operates more than 100 BTU reflow ovens at its state-of-the-art facilities in Shenzhen, Nanjing and Heyuan. A global leader in telecommunications and information technology, ZTE relies on BTU's Energy Pilot Software to reduce energy consumption.

296 more news releases from BTU International »

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