BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

Manufacturer

BTU HAS BEEN A LEADER IN IN-LINE THERMAL PROCESSING FOR OVER A HALF A CENTURY.

BTU’s products excel in processes where precise control of atmosphere and temperature are critical to product yield. With over 10,000 units shipped, service and support in over 30 countries, and manufacturing facilities on two continents BTU is the leading choice for global manufacturers.

PLATFORMS

The World’s Best Performing Reflow Ovens

Pyramax OvensBTU’s Pyramax family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. The Pyramax features BTU’s exclusive closed loop convection control and process temperatures up to 400°C. For the most demanding applications Pyramax can provide O2 levels as low as 2ppm above source in the peak reflow zone.

Custom Furnaces: Made in the USA

BTU’s Controlled Atmosphere Furnace has the industry’s lowest Cost of Ownership and features process temperatures up to 1180°C. BTU’s automated thermal controls utilize segmented heaters to optimize thermal performance resulting in thermal uniformity better than +/-2°C. The system also features flexible atmosphere with Argon, Hydrogen, Nitrogen or forming gas available.

BTU International Postings

4 products »

Pyramax Vacuum Reflow Oven

Vacuum Reflow for High-Volume Manufacturing The Pyramax Vacuu...

Reflow

Pyramax Vacuum Reflow Oven

Pyramax TrueFlat

NEW REFLOW OVEN TECHNOLOGY FOR SUBSTRATE FLATNESS Easy process transfer Low maintenance, no vacuum pump &l...

Reflow

Pyramax TrueFlat

PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven

Eliminate reflow oven changeover time. The PYRAMAX ZeroTurn is designed for high volume electronics manufacturers who must also manage process mix and are dissatisfied with the poor process separation of other dual cham...

Reflow

PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven

5 technical articles »

Operation of a Vacuum Reflow Oven with Void Reduction Data

Apr 21, 2021 | Fred Dimock

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness....

Thermal Profiles - Why Getting Them Right is Important

Oct 24, 2019 | Fred Dimock

Presentation given by Fred Dimock during a seminar at the American Competitiveness Institute, ACI. •Recipe vs. Profile •Material Properties •Why profiles are shaped like they are. •Obtaining profiles •TC Accuracy •Profilers •Test vehicles •Process Window – Eutectic vs. Lead Free •Heat transfer •Oven Control...

Lead-Free Solder Wafer Bumping

Dec 06, 2007 | Fred Dimock, Kristen Mattson.

Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition....

Making A Case for Continuous Furnaces

Nov 08, 2007 | Fred Dimock

A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace....

Maximizing Process Control with Controlled Convection Rates

Oct 10, 2007 | Rob DiMatteo, Fred Dimock, Pierre LeMieux.

Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection"....

331 news releases »

BTU International Appoints E-Tronix as Its Representative in Six States

Jul 15, 2024 | BTU International, Inc. is pleased to announce the appointment of E-Tronix as its representative in North Dakota (ND), South Dakota (SD), Minnesota (MN), Iowa (IA), Wisconsin (WI) and Illinois (IL).

BTU International Displays Multiple Reflow Solutions at SMTconnect 2024.

May 20, 2024 | BTU International, Inc. is pleased to announce its participation in SMTconnect 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. The company will exhibit its latest innovations in reflow technology at the booths of its manufacturers' representatives, ANS answer elektronik Service- & Vertriebs GmbH and Stratus Vision GmbH.

BTU International Redefines Operational Value and Efficiency with the Aurora Platform of Reflow Ovens

Mar 26, 2024 | BTU International, Inc. is proud to announce that its new Aurora platform of reflow ovens is designed to minimize the Cost of Ownership (CoO) while maximizing performance and operational value for its users. With a focus on precision, consistency, and efficiency, the Aurora platform sets a new standard for thermal processing in electronics manufacturing.

BTU's Aurora Scores Another Award – 2024 NPI Award Recipient

Mar 18, 2024 | BTU International, Inc. is proud to announce its receipt of the prestigious CIRCUITS ASSEMBLY 2024 NPI (New Product Introduction) Award in the Soldering – Reflow category. The award-winning product, the Aurora Reflow Oven Platform, represents a significant breakthrough in reflow soldering technology.

Key Highlights: Enhanced Modularity for Seamless Integration: CalcuQuote is proud to announce the evolution of its products to offer enhanced modularity. This strategic move ensures that all features

Mar 11, 2024 | BTU International, Inc. will introduce its award-winning Aurora Reflow Oven Platform, at the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. In Booth 2108, attendees can experience firsthand the groundbreaking Aurora 150N, a 12-zone reflow oven that sets a new standard for thermal processing technology.

Key Highlights: Enhanced Modularity for Seamless Integration: CalcuQuote is proud to announce the evolution of its products to offer enhanced modularity. This strategic move ensures that all features

Mar 11, 2024 | BTU International, Inc. will introduce its award-winning Aurora Reflow Oven Platform, at the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. In Booth 2108, attendees can experience firsthand the groundbreaking Aurora 150N, a 12-zone reflow oven that sets a new standard for thermal processing technology.

Key Highlights: Enhanced Modularity for Seamless Integration: CalcuQuote is proud to announce the evolution of its products to offer enhanced modularity. This strategic move ensures that all features

Mar 11, 2024 | BTU International, Inc. will introduce its award-winning Aurora Reflow Oven Platform, at the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. In Booth 2108, attendees can experience firsthand the groundbreaking Aurora 150N, a 12-zone reflow oven that sets a new standard for thermal processing technology.

BTU International Surpasses 50 Awards with 2023 GLOBAL Tech Award Win

Nov 20, 2023 | BTU International, Inc. is proud to announce its prestigious recognition at the 2023 GLOBAL Technology Awards for its outstanding contribution to the field of Reflow Soldering with the Aurora system. The award, which marked the company's 51st industry award, was announced during a ceremony that took place at productronica in Munich on Nov. 14, 2023.

BTU Supports Fastest Line Speeds with New Aurora 200N

Nov 06, 2023 | BTU International, Inc. is proud to introduce its latest innovation, the Aurora 200N, the longest and most advanced reflow oven ever produced by BTU. This groundbreaking addition to the Aurora platform sets a new standard for speed, efficiency, and flexibility.

BTU International Receives Double Honors with Two 2023 Mexico Technology Awards

Oct 31, 2023 | BTU International, Inc. is pleased to announce that it received not one, but two esteemed 2023 Mexico Technology Awards. The company secured recognition in the categories of Soldering Equipment – Reflow for its innovative Aurora system, and Software – Process Control for its cutting-edge Profile Tracer. These remarkable awards were announced during a distinguished ceremony held on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.

321 more news releases from BTU International »

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Reflow Oven