BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

Manufacturer of Assembly Equipment

BTU HAS BEEN A LEADER IN IN-LINE THERMAL PROCESSING FOR OVER A HALF A CENTURY.

BTU’s products excel in processes where precise control of atmosphere and temperature are critical to product yield. With over 10,000 units shipped, service and support in over 30 countries, and manufacturing facilities on two continents BTU is the leading choice for global manufacturers.

PLATFORMS

The World’s Best Performing Reflow Ovens

Pyramax OvensBTU’s Pyramax family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. The Pyramax features BTU’s exclusive closed loop convection control and process temperatures up to 400°C. For the most demanding applications Pyramax can provide O2 levels as low as 2ppm above source in the peak reflow zone.

Custom Furnaces: Made in the USA

BTU’s Controlled Atmosphere Furnace has the industry’s lowest Cost of Ownership and features process temperatures up to 1180°C. BTU’s automated thermal controls utilize segmented heaters to optimize thermal performance resulting in thermal uniformity better than +/-2°C. The system also features flexible atmosphere with Argon, Hydrogen, Nitrogen or forming gas available.

BTU International Postings

4 products »

Pyramax Vacuum Reflow Oven

Vacuum Reflow for High-Volume Manufacturing The Pyramax Vacuu...

Reflow

Pyramax Vacuum Reflow Oven

Pyramax TrueFlat

NEW REFLOW OVEN TECHNOLOGY FOR SUBSTRATE FLATNESS Easy process transfer Low maintenance, no vacuum pump &l...

Reflow

Pyramax TrueFlat

PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven

Eliminate reflow oven changeover time. The PYRAMAX ZeroTurn is designed for high volume electronics manufacturers who must also manage process mix and are dissatisfied with the poor process separation of other dual cham...

Reflow

PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven

5 technical articles »

Operation of a Vacuum Reflow Oven with Void Reduction Data

Apr 21, 2021 | Fred Dimock

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness....

Thermal Profiles - Why Getting Them Right is Important

Oct 24, 2019 | Fred Dimock

Presentation given by Fred Dimock during a seminar at the American Competitiveness Institute, ACI. •Recipe vs. Profile •Material Properties •Why profiles are shaped like they are. •Obtaining profiles •TC Accuracy •Profilers •Test vehicles •Process Window – Eutectic vs. Lead Free •Heat transfer •Oven Control...

Lead-Free Solder Wafer Bumping

Dec 06, 2007 | Fred Dimock, Kristen Mattson.

Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition....

Making A Case for Continuous Furnaces

Nov 08, 2007 | Fred Dimock

A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace....

Maximizing Process Control with Controlled Convection Rates

Oct 10, 2007 | Rob DiMatteo, Fred Dimock, Pierre LeMieux.

Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection"....

286 news releases »

BTU Named Best Emerging Exhibit of the Year 2021 for New Selective Wave Soldering System

Oct 21, 2021 | BTU International, Inc. was awarded The Best Emerging Exhibit of the Year 2021 China South for its Valence 3508 Selective Wave Soldering system by Hentec. BTU is the exclusive distributor for Hentec products in Asia.

BTU Will Demo its Flux Management Technology on a PYRAMAX Reflow Oven at productronica 2021

Oct 13, 2021 | BTU International, Inc. today announced plans to exhibit during productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. The company will showcase its Aqua Scrub™ Flux Management Technology and a PYRAMAX™ 125A with its representative STRATUS VISION Gmbh in Hall A3, Stand 441.

BTU to Exhibit Award-Winning Flux Management Technology at SMTAI

Oct 04, 2021 | BTU International, Inc. today announced plans to exhibit during the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company will showcase its Aqua Scrub™ Flux Management Technology in Booth #3412.

Selective Soldering and Vacuum Reflow from the Technology Leader at NEPCON South China

Jul 27, 2021 | BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.

Selective Soldering and Vacuum Reflow from the Technology Leader at NEPCON South China

Jul 27, 2021 | BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.

Bob Bouchard named Director of Sales – Americas forBTU International

Jun 16, 2021 | BTU International, Inc. announced today the promotion of Bob Bouchard to Director of Sales – Americas.

Rob DiMatteo Named General Manager of BTU International

Jun 04, 2021 | BTU International, Inc. announced today the promotion of Rob DiMatteo to General Manager.

BTU Awarded for New Selective Solder System

Apr 23, 2021 | BTU International, Inc. today announced that it was awarded a 2021 SMT China Vision Award in the category of Soldering – Selective for the Hentec Industries Valence 3508. The award was presented to the company during a ceremony that took place during NEPCON China in Shanghai. BTU is the exclusive distributor for Hentec products in Asia.

BTU Receives 3rd Award for NewHealth Check Service for Reflow Ovens

Apr 08, 2021 | BTU International, Inc. received a 2021 CIRCUITS ASSEMBLY NPI Award in the category of Soldering – Alternative for its Health Check Service. The award was announced during a special online awards ceremony on Tuesday, April 6, 2021.

BTU to Unveil New Selective Soldering System at NEPCON China

Mar 23, 2021 | BTU International, Inc. today announced plans to exhibit at NEPCON China, scheduled to take place April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Center. BTU will showcase its new selective soldering system for the first time – the Hentec Industries Valence 3508. BTU recently announced the distribution agreement limited to Asia with Hentec Industries.

276 more news releases from BTU International »

SMT spare parts - Qinyi Electronics

Reflow Oven