SMT Equipment

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

 S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

 S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

Name:

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

Category:

Inspection

Offered by:

Viscom AG

View S6053BO-V/S6056BO - Automatic In-line Wire bond AOI on Viscom AG website

Company Information:

Viscom AG

A leading provider of industrial image processing (AOI and AXI) Automated Optical and X-ray inspection equipment.

Hanover, Germany

Inspection

  • Phone +49-511-94996-0
  • Fax +49-511-94996-900

Viscom AG website

Company Postings:

(19) products in the catalog

(122) news releases

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI Description:

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S6053BO-V/S6056BO - Automatic In-line Wire bond AOI - Video Demonstration

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds

  • Inspection of minimal wire thicknesses up to 15 µm
  • Reliable differentiation of wire courses
  • Recognition of defective bonds
  • Reliable SMD component inspection
  • Inspection of conductive adhesive bond
  • Simple operation and inspection program generation with EasyPro
  • Flexible conveyor concept: Single track or double track
  • The data matrix code can be read from the program flow

In order to check the adhesive integrity of the bond connections or to detect missing wires on multiple bonds, an electrical test is insufficient. The automatic optical inspection system Viscom S6053BO-V for bond inspection guarantees reliable defect detection in typical bonds. During inspection, high resolution cameras register every solder joint and wire bond. The resulting images are evaluated with high performance, proven Viscom inspection software for a combined inspection of bond connections and SMD assembly.

The inspection scope includes, among other things, evaluation of bond positions, leads, dies and component position. It makes no difference whether the bonds are of copper, aluminum or gold, or whether ribbon or thick or thin wires are involved. Even thin wire bonds with a wire diameter as small as 17 μm can be reliably detected. The inspection program can also detect damaged and/or misplaced components. As an option, it is possible to measure loop height.

The standard library contains inspection patterns for die bonds, ball-to-wedge, wedge-to-wedge and security bonds. The inspection scope can be individually adjusted beyond the standard defects, for additional applications.

Inspection programs can be written and optimized off-line at the Viscom programming station; previously saved images are available for this purpose.

The combination of powerful SPC evaluation (statistical process control) with a wide variety of filter options for process optimization enables the system to operate in a closed loop for bonder control.

Efficient individualized support is provided through user support and service, which include remote diagnosis, a hotline and on site servicing. In addition, our Internet customer forum offers up-to-date information and assistance with everyday operation.


Worldwide service at the highest level

Experienced Viscom employees in Hanover and the international branch offices, as well as many international agents, support our customers worldwide. In Service alone, since 2009 a great number of flexible and highly trained employees were consolidated into a separate division. The offering includes routine servicing, troubleshooting, maintenance, calibration service and modernization, among others. Visit our website to find international subsidiaries and representatives in Europe, USA and Asia.

View S6053BO-V/S6056BO - Automatic In-line Wire bond AOI on Viscom AG website

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI was added in Jan 2016

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