KYZEN Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.


Founded in Nashville, Tennessee, KYZEN is the worldwide leader in the precision cleaning industry. Kyzen provides award winning cleaning chemistries for electronics and advanced packaging applications. We offer a broad range of process solutions ranging from sprayable aqueous cleaning formulations to engineered vapor degreasing solvents. Kyzen also has a fully equipped applications lab staffed with experts to help with customer process development. All of our products are environmentally friendly and effective in virtually all cleaning systems available today. Our goal is to provide our customers with integrated cleaning SOLUTIONS!

KYZEN’s Nashville, Tennessee USA Operation is unique with extensive Research and Developmental, Applications Testing, manufacturing and Global Headquarters functions. These best in the world facilities are complemented by our Applications and Engineering Laboratory in Manchester, New Hampshire, USA. These laboratories are fully equipped to support product development, analytical services, process development and customer process support challenges.

KYZEN Corporation Postings

32 products »

AQUANOX® A4727 - Enhanced Aqueous Assembly Cleaner

AQUANOX A4727 is an award-winning electronics assembly cleaning solution that provides exceptional results when cleaning printed circuit boards and advanced packaging assemblies. A4727 has been lab and field-tested in spray-in-air processes...

Cleaning Agents

AQUANOX® A4727 - Enhanced Aqueous Assembly Cleaner

AQUANOX® A4241 - Solution for PCB & Stencil Cleaning

AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can b...

Cleaning Agents

AQUANOX® A4241 - Solution for PCB & Stencil Cleaning

AQUANOX® A4625 - Aqueous In-Line Cleaning Solution

AQUANOX® A4625 is a versatile aqueous cleaning chemistry designed to clean the latest lead-free residues while providing brilliant mirrored solder finishes. Easy to use, AQUANOX® A4625 is environmentall...

Cleaning Agents

AQUANOX® A4625 - Aqueous In-Line Cleaning Solution

AQUANOX® A4625B - Aqueous Batch Cleaning Solution

AQUANOX® A4625B is an innovative aqueous chemistry designed for optimum effectiveness in batch washers. This easy to use product will remove all types of electronic flux residues including the latest lead free. AQUANOX® A4625B...

Cleaning Agents

AQUANOX® A4625B - Aqueous Batch Cleaning Solution

AQUANOX® A4633 - High Alkaline Aqueous Electronics Cleaning Solution

Concentrated Aqueous Electronics Cleaner AQUANOX® A4633 was designed to clean flux residues from electronic assemblies in high and medium pressure batch and in-line spray washers having short wash zones. The ingredients used in A46...

Cleaning Agents

AQUANOX® A4633 - High Alkaline Aqueous Electronics Cleaning Solution

AQUANOX® A4638 Advanced Packaging Cleaning Chemistry

Advanced Packaging Cleaning Chemistry AQUANOX® A4638 is an engineered electronic assembly and advanced packaging cleaning agent designed to remove flux residue from flip chip and low clearance components. AQUANOX&r...

Cleaning Agents

AQUANOX® A4638 Advanced Packaging Cleaning Chemistry

AQUANOX® A4639 - Electronic Assembly Aqueous Solution

AQUANOX® A4639 is an engineered aqueous cleaning fluid that is effective on a wide range of soils at low operating temperatures and concentrations. AQUANOX® A4639 provides exceptional cleaning results and protection of metallic surfaces wi...

Cleaning Agents

AQUANOX® A4639 - Electronic Assembly Aqueous Solution

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. AQUANOX® A4651US will provide brilliant solder joints with no sump side additives and cleans exceptio...

Cleaning Agents

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

AQUANOX® A4703 - Neutral pH Aqueous Cleaner

AQUANOX® A4703 is an aqueous cleaning solution designed with a pH neutral formulation combined with Kyzen's revolutionary inhibition technology providing superior material compatibility. A4703 is effective at concentrations as low as three...

Cleaning Agents

AQUANOX® A4703 - Neutral pH Aqueous Cleaner

AQUANOX® A4708 - pH Neutral Electronic Assembly Cleaning Chemistry

AQUANOX® A4708 is a neutral range pH chemistry designed to rapidly clean under densely populated low-gap PWB assemblies. AQUANOX® A4708 is effective on all flux types including no-clean and water soluble residues. AQUANOX®...

Cleaning Agents

AQUANOX® A4708 - pH Neutral Electronic Assembly Cleaning Chemistry

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9 technical articles »

Stencil Cleaning - A Practical Approach To Improving Yields And Maximizing Your Throughput

Nov 10, 2021 | Debbie Carboni

Main Points * Technologies for the job * More than a flat piece of Stainless * Compatibility * Solubility in stencil cleaning * Influencing factors * Best Practices to reduce misprints and increase yields...


Nov 04, 2020 | Mike Bixenman, DBA [Kyzen Corporation] Mark McMeen, [STI Corporation] Bruno Tolla, Ph.D. [Kester Corporation]

Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration....

Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance

Aug 14, 2019 | Mike Bixenman - KYZEN Corporation, Vladimir Sitko, Pavel Hub - PBT Works

Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.</p><p>Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.</p><p>This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part....

Electrochemical Methods to Measure the Corrosion Potential of Flux Residues

Jul 27, 2017 | Mike Bixenman, DBA, David Lober, Anna Ailworth - Kyzen Corporation, Bruno Tolla, Ph.D., Jennifer Allen, Denis Jean, Kyle Loomis - Kester Corporation

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components....

Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware

Jul 28, 2016 | Mike Bixenman, DBA - Kyzen Corporation | Ryan Hulse, PHD - Honeywell International | Joe McChesney - CSD Automation

Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.

Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.

The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported....

Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Oct 23, 2014 | Dr. Mike Bixenman; Kyzen Corporation, Julie Fields; Technical Devices Company, Eric Camden; Foresite.

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...)

The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components...

Stencil Printing Yield Improvements

Jun 05, 2014 | Dr. Mike Bixenman, Debbie Carboni, Jason Chan

Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.

(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement....

Compatibility of Cleaning Agents With Nano-Coated Stencils

Mar 12, 2013 | David Lober and Mike Bixenman, D.B.A.

High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils...

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

Jun 10, 2010 | Mike Bixenman, Steve Stach

This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies....

544 news releases »

KYZEN to Discuss Precision Metal Cleaners at MECSPE 2022

May 18, 2022 | KYZEN will exhibit at MECSPE 2022, the international reference fair for the manufacturing industry. The event is scheduled to take place June 9-11, 2022, at BolognaFiere in Bologna, Italy. The KYZEN team will discuss the benefits of its METALNOX M6386 Modified Alcohol Solvent Cleaner and METALNOX M6381EU Precision Hydrocarbon Solvent Cleaner in Stand H300.

KYZEN to Present Free Clean and Green Seminar – New and Advanced Cleaning Technologies

May 18, 2022 | KYZEN is pleased to announce that it will host the Clean & Green Seminar on Tuesday, June 7, 2022, at the Chicago Marriott Schaumburg from 8:30 a.m.-2:30 p.m.

Meet the KYZEN Clean Team in Mexico at SMTA Juarez and SMTA Tijuana

May 18, 2022 | KYZEN will exhibit at the SMTA Juarez and Tijuana Expo & Tech Forums in Mexico. The SMTA Juarez Expo & Tech Forum is scheduled to take place Thursday, May 19, 2022, at the CIITA – IPN Chihuahua. The SMTA Tijuana Tech Day & Expo will be held Thursday, May 26, 2022, at the Quartz Hotel. The KYZEN team will be available to discuss the newest addition to the award-winning AQUANOX product line: AQUANOX A4626.

Ethan Mueller Named to Products Finishing's Prestigious 40 Under 40 Award Program

May 05, 2022 | KYZEN is proud to announce that Ethan Mueller, its regional manager – Midwest, received a 2022 40 Under 40 Award from Products Finishing Magazine. The program is designed to recognize emerging leaders in the surface finishing industry. Annually, Products Finishing editors examines a long list of nominees with a wide range of skill sets. The recipients are chosen based on leadership and industry involvement.

KYZEN to Discuss 3D Printing Process Resin Cleaners at RAPID + TCT

May 05, 2022 | KYZEN will exhibit at RAPID + TCT 2022, scheduled to take place May 17-19, 2022, in Detroit, MI. The KYZEN clean team will discuss the KYZEN® 3D5701 and KYZEN® 3D5420 3D Printing Process TPM Resin Cleaners at Booth #1348.

Tom Forsythe to Present at the Electronics in Harsh Environments Conference

Apr 28, 2022 | KYZEN today announced that Tom Forsythe, Executive VP, will present during the Electronics in Harsh Environments Conference. The presentation, "Electrical Twin for Monitoring and Controlling Acceptable Levels of Flux and Other Process Residues," will take place on Wednesday, May 18, 2022, from 10:30-11 a.m. at the Park Plaza Victoria Amsterdam.

Let KYZEN steer you to safe cleaning alternatives to replace traditional solvents!

Apr 20, 2022 | KYZEN, the global leader in innovative environmentally friendly cleaning chemistries prides themselves on putting customers first. Whether that is creating the highest quality products, providing top-notch accessibility and assistance, or maintaining an understanding of industry changes, KYZEN has you covered. They are constantly focused on developing the best products and strategies to achieve customer cleaning goals.

Catch the KYZEN Clean Team at Three SMTA Expos in May

Apr 20, 2022 | KYZEN will exhibit at the SMTA Oregon, Michigan and Capital Expos in May to discuss its new AQUANOX® A4626 Next Generation Aqueous Cleaning Solution. The SMTA Oregon Expo will take place Tuesday, May 3, 2022, in Wilsonville, OR. The SMTA Michigan Expo is scheduled to take place Tuesday, May 17, 2022, in Liviona, MI. Lastly, the SMTA Capital Expo will be held Tuesday, May 24, 2022, in Laurel, Maryland.

KYZEN to Introduce Its New Aqueous Cleaning Solution at SMTconnect

Apr 13, 2022 | KYZEN will exhibit in Hall 4, Stand 138 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. The KYZEN team will showcase the company's newest aqueous cleaning solution, AQUANOX® A4626.

KYZEN to inform of solvent replacement chemistries offered for the Southern New England Design-2-Part Show

Apr 06, 2022 | KYZEN will exhibit at the Southern New England Design-2-Part Show, scheduled to take place April 20-21, 2022, in Uncasville, CT. The KYZEN clean team will be in Booth #463 ready to discuss the recently published finding by the EPA regarding potential changes in the industry and solvent replacements.

534 more news releases from KYZEN Corporation »

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