Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Manufacturer of Assembly Material, Soldering

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, performs, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®.

Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

Indium Corporation Postings

10 products »

Durafuse™ LT - Low Temperature Solder Paste

Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low applications that are looking for a reflow temperature below 210°C. Where traditional low-temperature solders often ...

Solder Materials

Durafuse™ LT - Low Temperature Solder Paste

Indium6.4R Water-Soluble Pb-Free Solder Paste

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It excels in both SnPb and Pb-free assembly processes, providing an exceptional reflow process window. This solder paste delivers outstanding stenci...

Solder Materials

Indium6.4R Water-Soluble Pb-Free Solder Paste

NanoFoil® Multi-Layer Bonding Material

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provide...

Materials

NanoFoil® Multi-Layer Bonding Material

Indium8.9 Pb-Free Solder Paste

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy system...

Solder Materials

Indium8.9 Pb-Free Solder Paste

SACM™ Soldering Alloy

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Addit...

Solder Materials

SACM™ Soldering Alloy

Solder Spheres

New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently resu...

Solder Materials

Solder Spheres

Indium Solder Wire

Solder Wire from the Indium Corporation is made to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full scale production volumes. Indium Solde...

Solder Materials

Indium Solder Wire

Indium Solder Pastes

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to g...

Solder Materials

Indium Solder Pastes

Solder Preforms

Preforms come in standard shapes such as squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held...

Solder Materials

Solder Preforms

Flux and Epoxy Products

Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (inc...

Solder Materials

Flux and Epoxy Products

25 technical articles »

Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies

Jul 24, 2019 | Brook Sandy-Smith

Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes....

Process Optimization for Fine Feature Solder Paste Dispensing

Dec 19, 2018 | Maria Durham, Greg Wade, and Brandon Judd; Indium Corporation, John Boggiatto; ITW EAE - Speedline Technologies

With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste....

Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance

Nov 20, 2018 | Brook Sandy-Smith, Indium Corporation and Terry Munson, Foresite Inc.

There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.

This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes....

Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue

Aug 29, 2018 | Eric Bastow

No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern....

A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations

Aug 17, 2017 | Dr. Ning-Cheng Lee & Fen Chen

At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process.

Examples including:

  • Large low stand-off components such as QFN, LGA
  • Components covered under electromagnetic shield which has either no or few venting holes
  • Components assembled within cavity of board
  • Any other devices with small open space around solder joints
...

A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP

Aug 17, 2017 | Ming Hu, Lee Kresge, and Ning-Cheng Lee

A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies....

Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly

Jun 13, 2017 | Chris Anglin

The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are some of the components that must be assembled to enable these portable electronic devices. It is widely accepted that about 65% of all end of the line defects occur in the stencil printing process. Given all of the above, it is critical that a precision stencil printing process be developed to support miniaturized electronic assembly.

This paper is a summary of a significant amount of experimental data and process optimization techniques that were employed to establish a precision SMT printing process....

Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?

Feb 09, 2017 | Eric Bastow

The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.

But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question....

Understanding SIR

Feb 06, 2014 | Chris Nash, Technical Support Engineer, Eric Bastow, Senior Technical Support Engineer; Indium Corporation.

Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The difference in the results is typically the result of SIR coupon preparation. This paper will discuss the issue of SIR coupon preparation, board cleaning techniques, and how board cleanliness directly affects SIR results....

Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly

Dec 27, 2013 | Mario Scalzo Senior Technical Support Engineer CSMTPE, Six-Sigma Black Belt

The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions....

15 more technical articles from Indium Corporation »

289 news releases »

Indium Corporation Announces Chinese Webinar Series

Aug 07, 2020 | Indium Corporation now offers Chinese-language webinars as part of its InSIDER Series program. The first Chinese webinar of the series was recently hosted by Dr. Ning-Cheng Lee, Vice President of Technology, who discussed defect elimination in thermal management.

Indium Corporation and KYZEN Experts to Host Cleaning No-Cleans Webinar

Jul 22, 2020 | Indium Corporation's Brian O'Leary, Global Accounts Manager, will partner with KYZEN's Debbie Carboni, Global Product Line Manager, Electronics, to present an InSIDER Series webinar on cleaning no-cleans. There will be two sessions of the webinar--Tuesday, August 4 at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) and Wednesday, August 5 at 5:30 a.m. Eastern Time (10 a.m. British Time/5:30 p.m. Malaysia Time).

Indium Corporation Expert to Host 5G Connectivity Webinar

Jul 22, 2020 | Indium Corporation's Jenny Gallery, Product Specialist, will host a webinar focused on gold-based thermal solutions for 5G connectivity. There will be two sessions on Wednesday, Aug. 5, during International Microwave Symposium's (IMS) virtual conference. The first session will be held at 8 a.m. Eastern Time (1 p.m. British Time/8 p.m. Malaysia Time), with the second at 2 p.m. Eastern Time (7 p.m. British Time/2 a.m., Aug. 6, Malaysia Time).

Indium Corporation Releases Report on Indium, Gallium Availability

Jul 22, 2020 | Indium Corporation has released a report on the worldwide availability of indium and gallium metal.

Indium Corporation Receives EM World's Innovation Award

Jul 22, 2020 | Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China.

Indium Corporation's Dr. Lee Co-Authors Book on Lead-Free Assembly

Jul 14, 2020 | Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, co-authored Assembly and Reliability of Lead-Free Solder Joints with Dr. John H. Lau. The book is a new source on lead-free solder joints for advanced reliability across the complete food chain of electronics products.

Indium Corporation Announces Spanish-Language Low-Temperature Solder Webinar

Jul 07, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an InSIDER Series webinar focused on the company's innovative low-temperature solder offering on July 21 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).

Indium Corporation Expert to Host Power Electronics Webinar

Jun 18, 2020 | Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.

Indium Corporation Announces Low-Temp Solder Webinars

May 12, 2020 | Indium Corporation's Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company's innovative low-temperature solder offering on May 12 at 2 p.m. and May 13 at 8 a.m. EST.

Indium Corporation’s Vareha-Walsh to Share Insights at World Congress of Smart Materials 2020

Jan 10, 2020 | Indium Corporation’s Donna Vareha-Walsh, Director of Sales and Global Supply Chain and Trade Compliance, will share her industry expertise at the 6th Annual World Congress of Smart Materials 2020, March 11-13, 2020, in Barcelona, Spain.

279 more news releases from Indium Corporation »

TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit

ADJUST-A-VAC Vacuum Tweezer for fragile components, wafers, MEMS devices tweezers