Company Information: provides engineering, processing and wholesaling of packaging required for the storage, transport, or handling of electronic devices and components. These are typically tapes, trays, tubes, totes, reels or other fixtures.

Ayer, Massachusetts, USA

Consultant / Service Provider, Distributor, Manufacturer

  • Phone (978) 772-2600
  • Fax (978) 772-3600

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Company Postings:

(3) products in the catalog





Offered by:

OX3 Corporation


Baking Description:

The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/reflow-sensitive surface mount devices. Semiconductor devices, based on their sensitivity to moisture, are classified into eight categories numbered as: MSL-1, MSL-2, 2a, 3, 4, 5, 5a, and 6, with 6 being the most sensitive to moisture. OX3 checks each incoming lot of semiconductors upon receipt for its moisture sensivity level number and its package thickness. With the aid of the Table below, we then determine the MSL baking process time required for those devices. The parts are baked in calibrated ovens for the specified time and dry-packed immediately upon removal in order to minimize any exposure to moisture.

Baking was added in Jan 2001

Baking has been viewed 132 times

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