SMT Equipment

Microsection / Cross-Section Analysis

Company Information:

Process Sciences, Inc.

SMT & PCBA Laboratory Services, X-ray inspection, BGA rework, BGA Reballing, Solder Failure Analysis, SMT Assembly Process Validation, SMT Assembly Process Training & Consulting.

Leander, Texas, USA

Consultant / Service Provider, Manufacturer, Research Institute / Laboratory / School

  • Phone 512-259-7070
  • Fax 512-259-7073

Process Sciences, Inc. website

Company Postings:

(11) products in the catalog

(1) technical library article

(2) news releases

Microsection / Cross-Section Analysis

Microsection / Cross-Section Analysis


Microsection / Cross-Section Analysis



Offered by:

Process Sciences, Inc.

Microsection / Cross-Section Analysis Description:

Please visit our main microsectional analysis page for more information.

Process Sciences uses microsection for both  failure analysis and process validation. Our cross sections reveal intermetallic layers, defects, and other physical characteristics that may not be detectable or measureable using non-destructive methods such as X-ray or CT scan. Our narrow focus on SMT ensures that our technicians have experience with the materials common to circuit assemblies, and are able to produce consistent, high resoution sections to reveal fine details like grain structure and intermetallic layer formations, while avoiding mistakes like scooping of soft metals, over-polishing through target layers, excessive scratching or improper potting technique.


 Cross-sectioning allows PSI to isolate and characterize failure modes such as fractures, delamination, PTH plating integrity, die bond separation, or poor solderability. Sectioned samples can also be viewed using our Scanning Electron Microscope (SEM) or Energy Dispersive X-ray Spectroscopy (EDS) equipment, for ultra high magnification inspection and/or elemental analysis. Even if your failure turns out to be other than attachment related, PSI can help you rule out SMT problems, steering your search toward the real culprit.


No need to wonder whether your process is working. PSI can verifty proper intermetallic layer and fillet formation, fulfilling an essential aspect of your test and validation model. With X-ray inspection and micro-sectioning, PSI can help you take the guesswork out of process validation. Our experienced analysts have practical experience with board fabrication, SMT assembly environments, and deconstruction of both assemblies and components.

Microsection / Cross-Section Analysis was added in Mar 2015

Microsection / Cross-Section Analysis has been viewed 3627 times

10 More Products from Process Sciences, Inc. :

Flux-Free Reflow Soldering

IPC Training & Certification - Blackfox