ASYMTEK Products | Nordson Electronics Solutions

A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.

Manufacturer of Assembly Equipment, Adhesives / Dispensing, Assembly, Component Packaging

Panorama S Line Inside Tour 2019

ASYMTEK Products have taken the lead for 35+ years to advance fluid dispensing, conformal coating, and jetting technologies. As part of the Nordson ELECTRONICS SOLUTIONS division, we focus on immediate and long-term possibilities, continuously innovating as technology and electronics applications evolve. By focusing on what’s possible, we bring more to our customers through innovative solutions, customization, applications expertise, and award-winning global support. 

Recognized for our innovative equipment and excellent service, ASYMTEK continues to offer advanced dispensing solutions for a range of precision assembly processes. These include semiconductor packaging, printed circuit boards, LEDs, flat panel displays, medical and biotechnical devices, and solar and photovoltaic products. We are an ISO 9001:2015 certified company and has received numerous awards for its service excellence and product innovations.

ASYMTEK Products | Nordson Electronics Solutions Postings

28 products »

Vortik Progressive Cavity Pump Solutions

The Vortik® family of progressive cavity pumps (PCP) are fully integrated with our industry-leading dispensing systems and software to deliver repeatable volumetric accuracy without interruption. B...

Dispensing

Vortik Progressive Cavity Pump Solutions

Forte - Advanced Dispenser

The Forte™ Series fuses leading technologies from our most advanced fluid dispensing system with proven features from our top selling dispensing platform to deliver exceptional productivity and accuracy. &...

Dispensing

Forte - Advanced Dispenser

Vantage - Advanced Dispensing for Precision Packaging and Assembly

Next-Generation Dispensing Capabilities for Precision Packaging and Assembly The Vantage® Series is specifically designed for advanced semiconductor package, electromechanical, and printed circ...

Dispensing

Vantage - Advanced Dispensing for Precision Packaging and Assembly

Helios SD-960 Large-Volume Fluid Dispenser

The Helios™ SD-960 Series is developed for medium to large volume dispensing applications in Electronics Assembly, like Thermal Interface Material (TIM), Potting, Gasketing and Sealing. The new Helios™ SD-960 Series (SD-960...

Dispensing

Helios SD-960 Large-Volume Fluid Dispenser

Spectrum II S2-900 Series Fluid Dispensers

Scalable Fluid Dispensers for Assembly of Semiconductors, MEMS, Storage Devices, and PCBs. High Speed, High Accuracy, Precision Dispensing System. The Spectrum II Series is the next evolution of the widely successful Spectr...

Dispensing

Spectrum II S2-900 Series Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

The next level of refinement, the Quantum™ Q-6800 Series is Nordson ASYMTEK’s latest high-performance, large-format dispensing platform. The Quantum platform has the same large dispense area as Axiom with a laser height sen...

Dispensing

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

IntelliJet Jetting System with ReadiSet Jet Cartridge

The IntelliJet® Jetting System with ReadiSet™ Jet Cartridge delivers cutting-edge reliability and micro dot dispensing for manufacturing advanced semiconductor and mobile electronics packages ReadiSet Jet Ca...

Dispensing

IntelliJet Jetting System with ReadiSet Jet Cartridge

DispenseMate Benchtop Dispensing System

Dispensing Power in a Compact Package The DispenseMate® Series brings new dispensing power to a compact package. In a benchtop format, many of today’s advanced automated dispensing features are available. Two models are offer...

Dispensing

DispenseMate Benchtop Dispensing System

Panorama - Automated Conformal Coating Line for Every Process

Nordson ASYMTEK designs automated conformal coating line solutions to fit your production process. Every Panorama™ line we build, includes the right balance of equipment and process control for optimal coating efficiency.

Coating Equipment

Panorama - Automated Conformal Coating Line for Every Process

Select Coat® Conformal Coating Applicators - SC-350 Select Spray and the SC-300 Multi-Mode

The Select Coat® Applicator Series – which includes the SC-350 Select Spray and the SC-300 Multi-Mode – is a highly-versatile conformal coating applicator that supports a wide range of fluid viscosities and is ideal for solvent or...

Coating Equipment

Select Coat® Conformal Coating Applicators - SC-350 Select Spray and the SC-300 Multi-Mode

See all products from ASYMTEK Products | Nordson Electronics Solutions »

12 technical articles »

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Jun 15, 2021 | Garrett Wong & Jinu Choi

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding....

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Feb 26, 2020 | Garrett Wong, Jinu Choi

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding....

Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization

Dec 07, 2017 | Camille Sybert, Michael Szuch

Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating....

Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing Systems

Nov 14, 2013 | Nordson Asymtek

Understanding accuracy and repeatability is an important step to analyze fluid dispensing system performance. They can also be prone to misinterpretation when reviewing a product specification. A dispensing motion system can be made to perform better or worse under different operating conditions. This article will explain accuracy and repeatability, and how they can be applied to different specifications. It will also discuss key considerations when interpreting accuracy and repeatability for decision making....

Conformal Coating Process Characterization Considerations

Sep 25, 2013 | Brad Perkins, Nordson ASYMTEK

Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers and manufacturers expect the electronics to work when subjected to dirt, humidity, moisture, corrosive materials, and various other contaminants. This expectation results in a drive to minimize the cost of the process. The lowest cost of ownership for a conformal coating process occurs by utilizing automated selective conformal coating equipment....

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Dec 17, 2012 | Brad Perkins, Jared Wilburn

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process....

Advanced Solder Paste Dispensing

Oct 15, 2008 | Asymtek

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices....

An Alternative Dispense Process for Application of Catalyst Films on MEA's

Oct 01, 2008 | Horatio Quinones, Brian Sawatzky.

This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared....

Dam and Fill Encapsulation for Microelectronic Packages

Aug 27, 1999 | Steven J. Adamson and Christian Q. Ness

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective......

Considerations in Dispensing Conformal Coatings

Aug 27, 1999 | John P. Byers and Christopher E. Havlik

Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards....

2 more technical articles from ASYMTEK Products | Nordson Electronics Solutions »

83 news releases »

Nordson TEST & INSPECTION enhance their offering with the launch of new products for industrial and pre-clinical X-ray imaging systems

Sep 26, 2021 | Nordson TEST & INSPECTION division, part of the Nordson Corporation (Nasdaq: NDSN), are pleased to announce the launch of our X-ray Technologies OEM product range for industrial & pre-clinical X-ray imaging systems. This new product line is the result of several months of development work following the acquisition of vivaMOS, a leader in high resolution dynamic X-ray detectors.

Nordson Electronics Solutions Introduces the MARCH MegaVIA™ Plasma Treatment System for Large Panels in Printed Circuit Board Manufacturing

Jun 30, 2021 | Increases process capacity for large PCB panels by more than 54% with only 2% increase in footprint

Nordson Electronics Solutions Ships First SELECT Unit from New Global Manufacturing Facility

Jun 23, 2021 | The relocation expands operations and capabilities for SELECT's selective soldering systems used in electronics manufacturing

Boost Fluid Dispensing Throughput up to 100% with the New ASYMTEK Forte™ MAX System from Nordson Electronics Solutions

Apr 29, 2021 | ASYMTEK Forte™ MAX offers dual jetting with real-time skew correction for faster, enhanced, automated fluid dispensing

YESTECH Selected by Mexico Technology Awards for FX-942UV ACI / AOI

Oct 29, 2020 | YESTECH Products, part of Nordson ELECTRONICS SOLUTIONS, received a 2020 Mexico Technology Award in the category of Conformal Coating for its FX-942UV ACI / AOI. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

Unique software for dispensing two-component fluids wins Global Technology Award for ASYMTEK Automated Ratio Calibration (ARC™) Technology

Oct 12, 2020 | Enables easier set-up and ensures accurate mix ratios by volume or weight to improve overall dispense quality ASYMTEK, a part of Nordson ELECTRONICS SOLUTIONS - a global leader in electronics manufacturing technologies, announces its latest technology has received the Global Technology Award 2020 for fluid dispensing equipment. Nordson Electronics Solutions developed the patent-pending software, Automated Ratio Calibration Technology (ARC™ Technology), to enable easier set-up and sustained mix ratios for dispensing two-component (2K) fluid materials. ARC Technology is part of a system, which includes ASYMTEK Vortik® progressive cavity pumps and ASYMTEK dispensing platforms, that ensures consistently accurate mix ratios by volume or weight to improve overall dispense quality. The award was announced by Global SMT & Packaging magazine during a virtual ceremony held on September 29, 2020.

Unique software for dispensing two-component fluids wins Global Technology Award for ASYMTEK Automated Ratio Calibration (ARC™) Technology

Oct 10, 2020 | ASYMTEK, a part of Nordson ELECTRONICS SOLUTIONS announces its latest technology has received the Global Technology Award 2020 for fluid dispensing equipment. Nordson Electronics Solutions developed the patent-pending software, Automated Ratio Calibration Technology (ARC™ Technology), to enable easier set-up and sustained mix ratios for dispensing two-component (2K) fluid materials. ARC Technology is part of a system, which includes ASYMTEK Vortik® progressive cavity pumps and ASYMTEK dispensing platforms, that ensures consistently accurate mix ratios by volume or weight to improve overall dispense quality. The award was announced by Global SMT & Packaging magazine during a virtual ceremony held September 29, 2020.

Solve your semiconductor packaging problems with Nordson ELECTRONICS SOLUTIONS at SEMICON Taiwan 2020

Sep 17, 2020 | Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment in one booth, #I2716

Awards Earned by ASYMTEK Products for Best New Product and Service Excellence at IPC APEX 2020

Feb 20, 2020 | ASYMTEK wins its 16th Service Excellence Award

ASYMTEK and DIMA Products Now Entirely Represented in Switzerland by neutec electronic AG

Feb 18, 2020 | Team offers its expertise in conformal coating and fluid dispensing equipment solutions for Swiss electronics manufacturing

73 more news releases from ASYMTEK Products | Nordson Electronics Solutions »

SMT & Test Auction From All Over The West (Best in the West)

Conformal Coating Machine under 40000