Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Manufacturer

Heller Industries Corporate Video

Heller Industries, the market leader in Reflow Soldering technology, supplies solutions for electronics manufacturers and assemblers worldwide.

Advanced manufacturing and production systems that supply both standard and special reflow ovens cost-efficiently, with rapid delivery. These capabilities are supported by corporate and fiscal strength, the result of consistency in management policies and engineering expertise over the past 42 years.

Our company-wide ISO 9001 program enhances communication within and among departments - as well as throughout our global network of regional managers, sales representatives, field service engineers and customers.  The cohesive management team ensures valuable continuity; the people you speak with today have a heritage and a future with the company. Our entire staff is grounded in engineering principles. This shared experience provides support in executing the company's various functions: assembly, design, service or quality assurance.

Since we introduced our first full convection reflow oven in 1987, Heller Industries has brought innovations and refinements to market at an accelerating rate. In the course of responding to forces that impel electronics assemblers to reduce their product development cycles, Heller has amassed considerable expertise in resolving reflow and curing issues. Having pioneered full convection reflow -now the standard of the industry - we have met, and continue to accept, major engineering challenges.

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Heller Industries Inc. Postings

9 products »

Convection Reflow Oven Mk7

Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the...

Reflow

Convection Reflow Oven Mk7

SMT Reflow Oven - 1826 Mark 5

The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace....

Reflow

SMT Reflow Oven - 1826 Mark 5

High Volume Reflow Oven - 1936/2043 Mark5

The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems....

Reflow

High Volume Reflow Oven - 1936/2043 Mark5

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot pr...

Reflow

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry!&...

Reflow

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to...

Reflow

Flux Free Formic Acid Reflow Oven - 1936 MKV

860 Pressure Curing Oven (PCO)

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a...

Curing Equipment

860 Pressure Curing Oven (PCO)

Vertical Curing Oven - Heller 788

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of fl...

Curing Equipment

Vertical Curing Oven - Heller 788

Vertical Curing Mini Oven - Heller 755

The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation...

Curing Equipment

Vertical Curing Mini Oven - Heller 755

18 technical articles »

Introducing Closed-loop Nitrogen Control To Solder Reflow

Jan 17, 2023 | David Heller

To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process....

How Challenging Conventional Wisdom Can Optimize Solder Reflow

Jan 17, 2023 | Marc Peo

As a manufacturing technology, SMT has acquired a "heritage" of widely accepted assumptions about its processes. However, yesterday'spractices are continually confronted by the shifting paradigms of today's production line....

The User Benefits of a Supplier Partnership

Jan 17, 2023 | Bjorn Dahle, Marc Peo

EQUIPMENT SUPPLIERS HAVE BECOME A RESOURCE FOR PROCESS CONTROL EXPERTISE, EVEN IN THE REFLOW OPERATION....

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Jan 17, 2023 | Yue Deng, Xike Zhao, Liang He, David Wright, Hossein Madanipour, Bret Halbe, Jung Kyu, Fred Tarazi, Gang Duan, Dror Trifon, Rahul Manepalli, David Heller

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process....

Flux Management

Jan 17, 2023 | Heller Industries

This paper describes the new flux management systems that Heller Industries introduced in 1999....

Function and Operational Theory of Condenser Tube Flux Collection System

Jan 17, 2023 | Heller Industries

Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors....

Repeatability of the Temperature Profile under Load Variation

Jan 17, 2023 | Prepared by: John Poling

Repeatability of the Temperature Profile under Load Variation...

Are You Ready for Lead Free

Jan 17, 2023 | Marc Peo & Don DeAngelo

Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates....

The Greening of the Reflow Process

Jan 17, 2023 | Atsushi Kikuchi

After years of concentration on resolving productivity- related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world's leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort....

Let's Get the Lead Out

Jan 17, 2023 | Marc Peo

Let's Get the Lead Out...

8 more technical articles from Heller Industries Inc. »

28 news releases »

HELLER Convenes a Successful 2024 Sales Kickoff Meeting, Setting the Stage for a Strong Year Ahead

Feb 26, 2024 | HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.

HELLER荣获"第17届一步步卓越奖":未来将持续引领真空回流焊技术

Oct 18, 2023 | 2023年10月11日,"Step-by-Step Excellence Awards一步步卓越奖"(SbSEA, 原Vision Awards远见奖)颁奖仪式在深圳NEPCON Asia展会隆重举办。本次获奖产品是由电子制造行业知名专家组成的评委会, 和一批经甄选的《一步步新技术》忠实读者,从本届众多的参加评选的新产品中, 评选出对于电子制造行业有显著贡献的产品。

HELLER'S High UPH Vacuum Oven Wins the "17th Step-by-Step Excellence Awards"

Oct 18, 2023 | HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.

HELLER Participates at the Beijing Intelligent Manufacturing and SMT Technology Exchange Conference

Jun 12, 2023 | The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.

HELLER Appeared at CEIA Wuhan Seminar

Jun 12, 2023 | HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform for networking and knowledge exchange.

HELLER Shanghai 2023 New Plant - Grand Opening

Apr 19, 2023 | As spring blossoms arrive and everything comes to life, HELLER Shanghai continues to grow and expand its capabilities in R&D, manufacturing, and customer support. In order to better serve its customers in China and around the world, and to meet future challenges and opportunities, HELLER China has moved to a new location after 21 years at their previous facilities in Shanghai.

Heller Industries Opens New Office and Demo Center in Taoyuan, Taiwan

Mar 30, 2023 | Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Nov 08, 2021 | Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Proud Recipient of 2021 Service Excellence Award for Soldering Equipment

Apr 14, 2021 | The 2021 Service Excellence Award for Soldering Equipment was given to Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers.

Soldering Company of the Year 2020 - Heller Industries

Nov 03, 2020 | 2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)

18 more news releases from Heller Industries Inc. »

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Reflow Oven