Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Manufacturer

Heller Industries Corporate Video

Heller Industries, the market leader in Reflow Soldering technology, supplies solutions for electronics manufacturers and assemblers worldwide.

Advanced manufacturing and production systems that supply both standard and special reflow ovens cost-efficiently, with rapid delivery. These capabilities are supported by corporate and fiscal strength, the result of consistency in management policies and engineering expertise over the past 42 years.

Our company-wide ISO 9001 program enhances communication within and among departments - as well as throughout our global network of regional managers, sales representatives, field service engineers and customers.  The cohesive management team ensures valuable continuity; the people you speak with today have a heritage and a future with the company. Our entire staff is grounded in engineering principles. This shared experience provides support in executing the company's various functions: assembly, design, service or quality assurance.

Since we introduced our first full convection reflow oven in 1987, Heller Industries has brought innovations and refinements to market at an accelerating rate. In the course of responding to forces that impel electronics assemblers to reduce their product development cycles, Heller has amassed considerable expertise in resolving reflow and curing issues. Having pioneered full convection reflow -now the standard of the industry - we have met, and continue to accept, major engineering challenges.

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9 products »

Convection Reflow Oven Mk7

Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the...

Reflow

Convection Reflow Oven Mk7

SMT Reflow Oven - 1826 Mark 5

The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace....

Reflow

SMT Reflow Oven - 1826 Mark 5

High Volume Reflow Oven - 1936/2043 Mark5

The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems....

Reflow

High Volume Reflow Oven - 1936/2043 Mark5

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot pr...

Reflow

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry!&...

Reflow

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to...

Reflow

Flux Free Formic Acid Reflow Oven - 1936 MKV

860 Pressure Curing Oven (PCO)

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a...

Curing Equipment

860 Pressure Curing Oven (PCO)

Vertical Curing Oven - Heller 788

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of fl...

Curing Equipment

Vertical Curing Oven - Heller 788

Vertical Curing Mini Oven - Heller 755

The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation...

Curing Equipment

Vertical Curing Mini Oven - Heller 755

18 technical articles »

Introducing Closed-loop Nitrogen Control To Solder Reflow

Jan 17, 2023 | David Heller

To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process....

How Challenging Conventional Wisdom Can Optimize Solder Reflow

Jan 17, 2023 | Marc Peo

As a manufacturing technology, SMT has acquired a "heritage" of widely accepted assumptions about its processes. However, yesterday'spractices are continually confronted by the shifting paradigms of today's production line....

The User Benefits of a Supplier Partnership

Jan 17, 2023 | Bjorn Dahle, Marc Peo

EQUIPMENT SUPPLIERS HAVE BECOME A RESOURCE FOR PROCESS CONTROL EXPERTISE, EVEN IN THE REFLOW OPERATION....

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Jan 17, 2023 | Yue Deng, Xike Zhao, Liang He, David Wright, Hossein Madanipour, Bret Halbe, Jung Kyu, Fred Tarazi, Gang Duan, Dror Trifon, Rahul Manepalli, David Heller

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process....

Flux Management

Jan 17, 2023 | Heller Industries

This paper describes the new flux management systems that Heller Industries introduced in 1999....

Function and Operational Theory of Condenser Tube Flux Collection System

Jan 17, 2023 | Heller Industries

Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors....

Repeatability of the Temperature Profile under Load Variation

Jan 17, 2023 | Prepared by: John Poling

Repeatability of the Temperature Profile under Load Variation...

Are You Ready for Lead Free

Jan 17, 2023 | Marc Peo & Don DeAngelo

Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates....

The Greening of the Reflow Process

Jan 17, 2023 | Atsushi Kikuchi

After years of concentration on resolving productivity- related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world's leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort....

Let's Get the Lead Out

Jan 17, 2023 | Marc Peo

Let's Get the Lead Out...

8 more technical articles from Heller Industries Inc. »

21 news releases »

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Nov 08, 2021 | Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Proud Recipient of 2021 Service Excellence Award for Soldering Equipment

Apr 14, 2021 | The 2021 Service Excellence Award for Soldering Equipment was given to Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers.

Soldering Company of the Year 2020 - Heller Industries

Nov 03, 2020 | 2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Dec 09, 2019 | The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

i4.0 Connect Forum - Fremont Marriott Silicon Valley

Sep 12, 2019 | Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.

Attention all USA Customers. No 25% Import Duty on Heller Reflow Ovens

Jul 02, 2018 | Heller Industries Announces That It Will NOT Be Subject To The 25% Import Duty on Reflow Oven Purchases

SMT Soldering Equipment Reflow Tool for Industry 4.0 - Frost & Sullivan Award

Sep 16, 2017 | Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.

Frost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0

Jun 22, 2016 | Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.

Lean Stream & Heller Reflow Technology to Partner in CA & NV

Nov 12, 2015 | Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!

Heller Industries Mark 5 Wins 2015 SMT China Vision Award

May 18, 2015 | Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015.

11 more news releases from Heller Industries Inc. »

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