NC676 - No Clean Solder Paste

Company Information:

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer

970-346-8002
970-346-8331

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Company Postings:

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Name:	NC676 - No Clean Solder Paste
Category:	Solder Materials
Offered by:	FCT ASSEMBLY, INC.

NC676 - No Clean Solder Paste Description:

NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time and good soldering activity with all surface finishes. NC676 meets or exceeds the requirements for ANSI/J-STD -004, -005 as well as all Bellcore test criteria for solder pastes. Residues left behind are clear and maintain a virtually indefinite pin probability life.

Attributes:

Excellent print consistency with Surface Area Ratios (SAR) as low as 0.55 when used with the UltraSlic™ stencil technology
No Hidden Halides - Completely halogen free by all test standards
Non-hygroscopic formulation suitable for high RH areas
Wide reflow window with good solderability on various PCB surface finishes
Unlimited pin probability and clear post-process residues
Low voiding/high reliability
Formulated for fast printing

Specifications:

Alloys	SN63 (MP=183°C) 62/36/2 (MP=179°C)
Powder Size	Type 3 and Type 4 Standard Type 5 available upon request
Applications	Automatic/Manual Printing Automatic/Manual Dispensing