Capabilities
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Capabilities |
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Capabilities Description:
System Design
• Functional specifications
• Hardware/Software architecture identification
• Preliminary cost estimates
Engineering Design and Management
• Specifications, flowcharts and milestone definitions
• Testing procedures and requirements, schematics
and equipment definitions
• Graphic design requirements
• CE/UL/SAA/FDA compliance testing requirements
• Production Jig Design and construction
• Bill Of Material Generation
Mechanical Design and Tool making
• Pro E and IGES CAD Tools
• Prototype sampling studio
• Control Drawing
• Injection molded tools Design
• Selection/analysis of material
• Metal Parts Design
• Rubber Key Pad Design
• CNC/Sparking/Milling Tool Making
Circuit Design and PCB Layout
• Single/ Multi sided PCB Layout
• Component identification and sourcing
• Prototyping /model building
Software Design
• MCU Programming. Motorola, Toshiba, UMC, Winbond,
Realtek, Scenix, Sitronix, TI, etc.
• SW Simulation on PC Design
• Artificial Intelligence Design Capability
Production/Post Production Capabilities
• Automatic and semi-automatic bonding
• Wave Soldering
• SMT/ Manual Insertion - Volume Assembly. 5500
sq. ms. Assembly Plant
• MRP 2/ISO 9002/EN 14002 Quality Control System.
Rigid Internal Quality
standards
• Worldwide Shipping and Logistics Ex Hong Kong/
PRC
Capabilities was added in Jun 2006
Capabilities has been viewed 141 times