Finetech

Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.

Repair/Rework, Soldering

The core businesses of Finetech are in the fields of precision component placement, flip chip and optoelectronic bonding, and SMT rework. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military and universities. Finetech works with companies from the start-up phase to large multi-user corporations.

In November 2009, Finetech acquired Martin GmbH, a manufacturer of PCB rework and dispensing equipment located in Wessling, Germany.  With the acquisition, Finetech offers the complete PCB rework range -- from simple hand soldering solutions, stand-alone BGA reball ovens and entry-level rework systems to advanced rework equipment for complex applications.

FINEPLACER® rework systems provide solutions for all types of advanced rework applications - BGA, 01005, stacked die, PoP, QFN, flip chip, RF shields, underfill, small passives, reballing, and more.

The product range includes different types of Fineplacer systems (manual, semi-automatic and automatic PCB rework stations or bonding and assembly platforms) and a wide range of additional tools and modules. Depending of specific configurations, the Fineplacer systems are suitable for R&D and prototype environments (high-accuracy, low-volume) as well as for more fully-automated production with higher volumes / higher rework yields.

Finetech Postings

10 products »

FINEPLACER® coreplus - Medium Size BGA Rework Station

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technolo...

Rework & Repair Equipment

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER pico rs - High Density SMT Rework Station

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of ...

Rework & Repair Equipment

FINEPLACER pico rs - High Density SMT Rework Station

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

Future in Advanced Rework. The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy...

Rework & Repair Equipment

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

Minioven Compact IR Reflow Oven

The new MiniOven-05 is a compact and versatile IR reflow oven suitable for a wide range of SMD components. This newest version provides enhanced process capability with updated firmware and increased control and temperature stability. Th...

Rework & Repair Equipment

Minioven Compact IR Reflow Oven

CleverDispense Compact Tabletop Dispenser

Dispensing varied materials across a wide range of viscosities – using the same equipment! Especially solder paste and other filled media have always been particularly demanding when reliable and consistent results are expected. The Clever D...

Rework & Repair Equipment

CleverDispense Compact Tabletop Dispenser

Hotbeam Underheater

The compact and flexible IR underheater HOTBEAM is the ideal supplement to a FINEPLACER® rework station. With modest space requirements and an overall height of only 40 mm, the IR underheater can be accommodated on every working ...

Rework & Repair Equipment

Hotbeam Underheater

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled env...

IC Packaging

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different...

IC Packaging

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER® pico ma - Multi-purpose Bonder

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applicati...

IC Packaging

FINEPLACER® pico ma - Multi-purpose Bonder

High Force ACF Bonder

Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications...

IC Packaging

High Force ACF Bonder

88 news releases »

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Jan 14, 2019 | Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Apr 07, 2016 | Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 27, 2013 | Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.

Finetech Unveils High Force ACF Bonder

Nov 08, 2013 | Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.

Al Cabral Joins Finetech as Regional Sales Manager

May 28, 2013 | Finetech & Martin announce the appointment of Al Cabral as Regional Sales Manager.

Donated Finetech Die Bonder Installed at Pennsylvania State University

Mar 11, 2013 | A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 16, 2013 | Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Jan 04, 2013 | Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Oct 03, 2012 | Finetech will highlight the FINEPLACER® core rework system in the Finetech/Martin Booth #236 at the upcoming SMTA International Conference and Expo

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 26, 2012 | MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,

78 more news releases from Finetech »

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