Nihon Superior Co., Ltd.

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Manufacturer of Assembly Material, Soldering

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Since then, we have made our mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry.

Backed by our knowledge of these technologies, we have developed into a global company by establishing manufacturing and sales centers in Japan as well as in Asia and Europe, and by forming business partnerships with overseas companies.

We are committed to earning our customers' highest level of trust by taking full responsibility for every product we deliver to them, and we are ready to meet their rising demands for diversification, increasingly sophisticated technologies, and environmental protection. As always, we appreciate your ongoing support of our business endeavors.

SN100C World.

The lead-free solder SN100C is an alloy of tin, copper, nickel and germanium. Its unique properties make it possible to achieve high productivity in soldering processes to produce cost effectively reliable joints. Special features include high fluidity, low copper erosion, low drossing, superior wetting and freedom from shrinkage defects. The number of companies using SN100C has grown dramatically since its first application in 1999 in the soldering of VCR boards.

Nihon Superior Co., Ltd. Postings

6 products »

NS Flux-Cored Lead Solder

We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. ...</p>
       <p class=Solder Materials

NS Flux-Cored Lead Solder

eFlux Lead-Free Soldering Flux

eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum ...

Solder Materials

eFlux Lead-Free Soldering Flux

eBall Lead-Free Solder Spheres

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge)

Solder Materials

eBall Lead-Free Solder Spheres

ePaste Lead-Free Solder Paste

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for re...

Solder Materials

ePaste Lead-Free Solder Paste

eCore Flux-Cored Lead-Free Solder Wire

In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive f...

Solder Materials

eCore Flux-Cored Lead-Free Solder Wire

NS Lead Solder

A rich and line-up of solders possessed of various characteristics and properties. NSH63V forms a strong join and displays excellent resistance to heat cycle stress, thus prolonging the working life of various electrical devices.

Solder Materials

NS Lead Solder

5 technical articles »

Dissolution in Service of the Copper Substrate of Solder Joints

Jun 20, 2019 | Nihon Superior Co., Ltd, Department of Materials, Imperial College London

It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.<p><p>This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni....

Controlling Voiding Mechanisms in the Reflow Soldering Process

Nov 15, 2017 | Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita

While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process....

Effect of Cooling Rate on the Intermetallic Layer in Solder Joints

Feb 28, 2013 | Keith Sweatman, Tetsuro Nishimura, Stuart D. McDonald, Kazuhiro Nogita

While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two different crystal forms over the temperature range to which electronics circuitry is exposed during assembly and service, it has only recently been recognized that the change from one form to the other has implications for solder joint reliability. (..) In this paper the authors report a study of the effect of cooling rates on Cu6Sn5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction. The findings have important implications for the manufacture of solder joints and their in-service performance... First published in the 2012 IPC APEX EXPO technical conference proceedings.......

Strength of Lead-free BGA Spheres in High Speed Loading

Apr 08, 2008 | Keith Sweatman, Shoichi Suenaga, Tetsuro Nishimura

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension....

High Reliability Lead-free Solder SN100C?Sn-0.7Cu-0.05Ni?Ge?

Mar 31, 2008 | Satoshi Mizuta

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C....

143 news releases »

SN100C Celebrates 20 Years of Reliable Service at APEX

Jan 04, 2019 | Nihon Superior today announced plans to exhibit in Booth #1334 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29 - 31, 2019 at the San Diego Convention Center in Ca. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. SN100C (032) flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.

New SN100CV solder paste from Nihon Superior at SMTAI reduces voiding

Sep 18, 2018 | Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Introduces Improved Flux-Cored Solder Wire

Sep 11, 2018 | Nihon Superior Co.has developed a new flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The new cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures.

Nihon Superior to Exhibit New SN100CV Solder Alloy at NEPCON South China

Jul 24, 2018 | Nihon Superior scheduled to take place Aug. 28-30, 2018 at the Shenzen Convention & Exhibition Center. The company will debut the new SN100CV™ P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior to Exhibit the New SN100CV Solder Alloy at NEPCON China

Apr 03, 2018 | Nihon Superior will exhibit in Stand 2L31 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Rebrands SN100C Alloy with New Logo

Mar 27, 2018 | Nihon Superior Co.is pleased to introduce its new SN100C logo. The logo replaces the originally used SN100C logo and will be used worldwide to brand this important alloy. The announcement was made during the recent IPC APEX EXPO in San Diego.

Tetsuro Nishimura Earns IPC Distinguished Committee Service Award

Mar 22, 2018 | Nihon Superior today announced that its President Tetsuro Nishimura has received a Distinguished Committee Service Award in recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry. IPC – Association Connecting Electronics Industries® presented the award at the recent IPC APEX EXPO that took place at the San Diego Convention Center.

Nihon Superior to Introduce New SN100CV Solder Alloy at APEX

Jan 28, 2018 | Nihon Superior will exhibit in Booth #1019 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in California. The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI

Aug 15, 2017 | Nihon Superior will exhibit in Booth #532 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Aug 10, 2017 | Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

133 more news releases from Nihon Superior Co., Ltd. »

Flying Probe Probe Tester with AOI

PCB Rework / Repair Services