Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Since then, we have made our mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry.
Backed by our knowledge of these technologies, we have developed into a global company by establishing manufacturing and sales centers in Japan as well as in Asia and Europe, and by forming business partnerships with overseas companies.
We are committed to earning our customers' highest level of trust by taking full responsibility for every product we deliver to them, and we are ready to meet their rising demands for diversification, increasingly sophisticated technologies, and environmental protection. As always, we appreciate your ongoing support of our business endeavors.
The lead-free solder SN100C is an alloy of tin, copper, nickel and germanium. Its unique properties make it possible to achieve high productivity in soldering processes to produce cost effectively reliable joints. Special features include high fluidity, low copper erosion, low drossing, superior wetting and freedom from shrinkage defects. The number of companies using SN100C has grown dramatically since its first application in 1999 in the soldering of VCR boards.
Nihon Superior Co., Ltd. Postings
A new silver-free and lead-free solder alloy is now available from Nihon Superior. It reduces the wear rate of soldering tips. It is a new alloy developed to reduce soldering tip wear. It can achieve an improvement of about threefold compare...
We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. Solder Materials
eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum ...
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge)
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for re...
In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive f...
Jun 20, 2019 | Nihon Superior Co., Ltd, Department of Materials, Imperial College London
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.<p><p>This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni....
Nov 15, 2017 | Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process....
Feb 28, 2013 | Keith Sweatman, Tetsuro Nishimura, Stuart D. McDonald, Kazuhiro Nogita
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two different crystal forms over the temperature range to which electronics circuitry is exposed during assembly and service, it has only recently been recognized that the change from one form to the other has implications for solder joint reliability. (..) In this paper the authors report a study of the effect of cooling rates on Cu6Sn5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction. The findings have important implications for the manufacture of solder joints and their in-service performance... First published in the 2012 IPC APEX EXPO technical conference proceedings.......
Apr 08, 2008 | Keith Sweatman, Shoichi Suenaga, Tetsuro Nishimura
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension....
Mar 31, 2008 | Satoshi Mizuta
While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C....
Oct 07, 2021 | Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.
Feb 08, 2021 | Nihon Superior Co. Ltd. is pleased to announce that Senior Technical Advisor Keith Sweatman received an Honorable Mention from the SMTA for the "Best of Proceedings" Award for SMTA International 2020. The members of the conference technical committee selected his paper, "Behavior and Strengthening Effects of Sb in a Low Bi-Sn-Cu alloy" on the basis that it represented the integrity and technical quality for which the SMTAI International program is known.
Jan 06, 2021 | Nihon Superior Co. Ltd. is pleased to announce its 55th year in business. Toshiro Nishimura, Chairman and founder, started the company by importing brazing alloys and supplying them to Japanese companies in the metal-joining industry.
Dec 04, 2020 | Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, Senior Technical Advisor, will participate in a panel discussion on Tuesday, Dec. 8, 2020 at 7:30 a.m. PCT / 10:30 a.m. EST / 3:30 p.m. GMT / 4:30 p.m. CET. The panel discussion is entitled "Low temperature solders – revisited."
Feb 06, 2020 | Nihon Superior Co. Ltd. was awarded a 2020 NPI Award in the category of Cored Wire for its new TipSave N flux-cored solder wire. The award was presented to the company during a Tuesday, Feb. 4, 2020 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Feb 06, 2020 | Nihon Superior Co. Ltd. was awarded an IPC APEX EXPO 2020 Innovation Awardon Tuesday, Feb. 4, 2020 during the opening keynote.
Jan 06, 2020 | Nihon Superior Co. Ltd. is pleased to announce plans to showcase its new TipSave N flux-cored solder wire in Booth #2043 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company also will exhibit SN100CV P608 D5 solder paste.
Oct 29, 2019 | Nihon Superior Co. Ltd. is pleased to announce the introduction of its new TipSave N flux-cored solder wire. The newly developed TipSave N flux-cored solder wire extends soldering iron tip life by 3X.
Aug 21, 2019 | Nihon Superiorwill exhibit in Booth #518 at 2019 SMTA International. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Aug 17, 2019 | OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.