Austin American Technology

Austin American Technology engineers and manufactures high performance cleaning systems. Our systems include batch and inline; aqueous and solvent; spray in air and spray under immersion with ultrasonics.

Cleaning

AAT was founded in 1986, as a provider of hot gas rework systems and solder paste testing. In 1988, our focus shifted toward the high-end electronics cleaning segment with the introduction of the world's first automated stencil cleaner. In the 1990's, we developed several batch cleaning systems and were early adopters of closed-loop (zero-discharge) capability. During that period, we acquired the cleaning equipment division of ECD, offering batch systems that excelled in solvent and semi-aqueous-based cleaning.

In 2000, Austin American Technology became a market leader in inline cleaning systems with the introduction of the award-winning HYDROJET™ series. Patented cleaning and drying technologies were incorporated into an energy and space-efficient format to set new standards for performance and low cost of ownership. Building on this success, AAT introduced the MICROJET™ inline flip chip cleaner to provide high volume cleaning capability in a small footprint.

Austin American Technology Postings

7 products »

HydroJet™ Inline PCB Cleaners

Aqueous / Semi-Aqueous Inline PCB Cleaning Systems Durable Construction The HydroJet™ in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life. It h...

Cleaning Equipment

HydroJet™ Inline PCB Cleaners

NanoJet™ Inline PCB Cleaners

There is nothing else like it! Designed, patented, and manufactured in the USA, the NanoJet™ from Austin American Technology combines recent advancements made in conveyor driven cleaning systems into the world's smallest, full...

Cleaning Equipment

NanoJet™ Inline PCB Cleaners

Mega™ ION Batch PCB Cleaners

World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel ...

Cleaning Equipment

Mega™ ION Batch PCB Cleaners

MicroJet™ Inline PCB Cleaners

Aqueous and Semi-Aqueous PCB Cleaning Systems The MicroJet™ Inline cleaning System with Progressive Energy Dynamics™ provides the highest level of SMT cleaning available on the market today. Progressive...

Cleaning Equipment

MicroJet™ Inline PCB Cleaners

X-Series PCB Stencil Cleaners

PCB Stencil & Misprint Cleaning Systems Austin American Technology's X-Series™ Vertical Format Batch Cleaning Systems provide maximum chemistry flexibility to meet a wide variety of applications. Aqueous, sapon...

Cleaning Equipment

X-Series PCB Stencil Cleaners

HydroJet™ SW - Solar Panel Cleaner

HydroJet™ SW Solar Aqueous / Semi-Aqueous Inline Electronic Cleaning Systems Breakthrough advances in cleaning technology bring Progressive Energy Dynamics to the HydroJet In-line Cleaning System resulting in unparalleled cle...

Cleaning Equipment

HydroJet™ SW - Solar Panel Cleaner

AquaTherm™ PCB Batch Cleaners

High Temperature, High Pressure Aqueous/Semi-Aqueous Batch Electronics Cleaning Systems Forget the limitations of the past and experience a batch system that offers multiple cleaning technologies for capability previously unachieve...

Cleaning Equipment

AquaTherm™ PCB Batch Cleaners

3 technical articles »

Optimizing Batch Cleaning Process Parameters for Removing Lead-Free Flux Residues on Populated Circuit Assemblies

Sep 18, 2009 | Steve Stach, Austin American Corporation, Mike Bixenman, Kyzen Corporation

Electronic assembly cleaning processes are becoming increasingly more complex because of global environmental mandates and customer driven product performance requirements. Manufacturing strategies today require process equivalence. That is to say, if a product is made or modified in different locations or processes around the world, the result should be the same. If cleaning is a requirement, will existing electronic assembly cleaning processes meet the challenge? Innovative cleaning fluid and cleaning equipment designs provide improved functionality in both batch and continuous inline cleaning processes. The purpose of this designed experiment is to report optimized cleaning process parameters for removing lead-free flux residues on populated circuit assemblies using innovative cleaning fluid and batch cleaning equipment designs....

What Cannot Be Cleaned In a Stencil Cleaner

Sep 18, 2009 | Steve Stach, Austin American Technology

The stencil cleaner can be one of the most versatile tools on the manufacturing floor. It can be used to clean electronic modules in various stages of the manufacturing process. In fact, an automated stencil cleaner can clean just about anything you come up against in your PCB assembly process....

Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies.

Jul 09, 2009 | Steve Stach.

Sometimes you just cannot clean with water. Good examples of this are: circuits with batteries attached, cleaning prior to encapsulation, ionic cleanliness testing, and non-sealed or other water sensitive parts. High impedance or high voltage circuits need to be cleaned of flux residues and other soils to maximize performance and reliability and, in these types of circuits; water can be just as detrimental as fluxes. When solvent cleaning is called for, Hansen solubility parameters can help target the best solvent or solvent blend to remove the residue of interest, and prevent degradation of the assembly being manufactured. In short, using this approach can time, manufacturing cost and reduce product liability....

4 news releases »

Austin American’s NanoJetTM Aqueous Inline Cleaning System Takes New Product (NPI) Award at APEX 2013

Mar 26, 2013 | AAT's new Nanojet™ won a coveted New Product Introduction (NPI) Award, which was presented to Steve Stach, President, on February 19 at IPC/APEX 2013 in San Diego, California. The annual award recognizes innovative and industry-leading new products in electronics manufacturing.

Austin American Technology offers Cash for Clunkers

Aug 07, 2009 | AAT has decided to create its own Cash for Clunkers program. While the economic indicators in this industry are not very favorable, AAT thinks that by implementing its own stimulus program we can ease the burden in the electronics industry by offering OEM's and CEM's that have outdated or technically distressed PCB cleaning equipment the opportunity to receive a rebate to apply towards a new AAT batch or inline system.

In-Line Flip Chip Cleaning Now Available With AAT'S New HydroJet Flip Chip Inline Cleaner

Aug 24, 2001 | Austin American Technology has successfully qualified and is now introducing an automated cleaning and drying system based on its highly successful Mach I and Mach III Series HydroJet Inline Cleaner. Advances and improvements in the configuration of the system have given it the ability to efficiently clean and thoroughly dry delicate Flip Chip assemblies at in-line speeds.

AAT's Mega™ II Cleaner Ideal for Flip Chip, Advanced Package Cleaning

Jun 26, 2001 | The Mega™ II's revolutionary closed-loop, solvent (or water), electronic assembly and parts cleaning system with quantitative ION detection and statistical process control capability is ideal for Flip Chip, Optoelectronics, and advanced or high reliability technology packages and assemblies.

reflow oven profiler

Jetting Pump for Integration