TT Electronics

Solving technology challenges for a sustainable world Take a closer look at TT and you'll soon discover that the most important things we offer aren't manufactured...

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1 technical article »

Assembly and Rework of Lead Free Package on Package Technology

Jan 16, 2024 | Raymond G. Clark and Joseph D. Poole

Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components....

1 news release »

TT electronics Appoints John Bran as VP, Global Business Development

Apr 09, 2009 | WEYBRIDGE, UNITED KINGDOM, April 2, 2009 ? TT electronics -integrated manufacturing services, a leading provider of comprehensive electronics design, manufacturing and product management services, announced today the appointment of John Bran to Vice President, Global Business Development.

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