Electronics Manufacturing

Electronics Manufacturing Description:

9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 environment Press fit Connector ion on any type of Multilayer board using Pneumatic Press. 1-24 layer board Assembly Board Size : 508 mm x 460 mm Board Types: Rigid, Flex & Ceramic Substrates Aqueous cleaning ( Water Wash) capability Placement Machines-Siemens, Fuji, Philips, Yamaha, Juki, Screen Printers: DEK, MPM, HTI Reflow Machines: Vitronics , Heller,