SAKI America
Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication.
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology.
Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality.
Saki Corporation has headquarters in Tokyo, Japan with offices, sales, and support centers around the world.
SAKI America Postings
5 products »
BF-Planet-X II - Smallest Footprint, Inline, High-Speed 2D AOI
For M-size boards, this inline, high-speed, space-saving model, at only 60cm wide, has the smallest footprint in its class. It handles boards of 330x250mm and scans them in only 4 seconds....
Saki's offline inspection series improves line productivity with shorter takt time and delivers the same high-quality results as inline systems. BF-Comet10/ BF-Comet18 - Accurate, high-speed performance in a desktop model. ...
BF-3Si In-line 3D Solder Paste Inspection System
Saki's BF-3Si is one of the world's fastest 2-projector solder paste inspection systems while Saki's Phase Measurement Profilometry with Liquid Crystal on Silicon (LCoS) technology ensures high repeatability of inspect...
BF-X3 3D Automated X-ray Inspection (AXI) System
Saki's automated high-resolution 3D X-ray inspection and measurement systems enable high image quality defect detection. Saki's systems are based on reliable hardware design, superior reliability, safety, and ease of maintenance, and are b...
Key Factor 1: Advanced Hardware Features Proprietary Hardware provides accurate measurements Saki's machines are built with hardware that's made to last. A closed-l...
35 news releases »
Saki Corporation Introduces Ultra-fast, Inline, 2D Bottom-side Automated Optical Inspection for PCBs
Apr 23, 2019 | Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany. Saki's 2D line-scan technology is ultra-fast, capturing the image of an entire 460x500mm printed circuit board assembly (PCBA) and carriers of 610x610mm in one pass, in real time, storing the image into memory, and creating inspection data for the entire board. This versatile system automates the bottom-side inspection process, eliminates board flipping and handling, and ensures quality after the potting, dip, wave, and selective soldering processes.
Feb 09, 2019 | Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that it has received a 2019 New Product Introduction (NPI) Award in the Test & Inspection--Automated Optical Inspection (AOI) category for its Saki Self-Programming Software. The NPI award, sponsored by Circuits Assembly and Printed Circuit Design and Fab, part of UP Media Group, recognizes a product's creativity and innovation, compatibility with existing technology, cost-effectiveness, expected reliability, flexibility, performance, and user-friendliness.
Jan 28, 2019 | Saki Corporation announces that SAKI's automated optical inspection (AOI) systems are the first AOI systems certified to support Panasonic's latest Advanced Process Control-Mounted Feedback (APC-MFB2 ) system. Field tests conducted using SAKI's 3D AOI systems to provide feedback data to Panasonic's APC-MFB2 system resulted in maximization of overall equipment effectiveness (OEE) through increases in process stability and yield. The entire lineup of SAKI 3D AOI systems, in all available image resolutions, including 7µm, 12µm, and 18µm, were certified.
Saki Demonstrates 3D SPI, AOI, AXI, and 2D Bottom-side AOI at IPC APEX Expo Booth 1407
Jan 22, 2019 | Saki Corporation will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, CA, at booth #1407. In addition, Saki's M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.
Saki recognized with Mexico Technology Award for its Saki Self-Programming Software
Jan 05, 2019 | Saki Corporation was honored with the Mexico Technology Award in the category of Inspection Equipment-SPI Systems for its Saki Self-Programming (SSP) Software. SSP software revolutionizes the assembly process with the first software that programs solder paste inspection (SPI) and automated optical inspection (AOI) equipment in just a few minutes and clicks, instead of hours, without a golden board. The award was presented at a ceremony held at the SMTA Expo and Tech Forum held in Guadalajara, Mexico.
Oct 07, 2018 | Saki Corporation will present its new 3Di Automated Optical Inspection (AOI) system at the Fuji America booth #407, at SMTA International. Saki's AOI system plays a vital role in enabling M2M communication and helping to make the Smart Factory and Industry 4.0 a reality. Fuji Corporation is a supplier of surface mount technology pick-and-place solutions and has produced many innovations in the circuit board assembly world.
Saki Selects Jayson Moy as General Manager, Saki Asia Pacific
Sep 23, 2018 | Saki Corporationannounces that it has selected Jayson Moy as General Manager of Saki Asia Pacific Pte Ltd, Singapore. Moy has an extensive background in the electronics industry. As managing director for all aspects of Saki Asia Pacific, he'll be responsible for Saki's complete line of 2D and 3D automated solder paste, optical, and x-ray inspection and measurement systems. Saki Asia Pacific covers all of Asia, with the exception of Japan, Greater China, and Korea.
Saki Self-Programming 3D Inspection Software is Fast, Easy, and Doesn't Require a Programmer
Aug 14, 2018 | Saki Corporation introduces Saki Self-Programming Software, the first self-programming software for solder paste inspection (SPI) and automated optical inspection (AOI) equipment. Saki Self-Programming (SSP) software, installed on Saki's 3D SPI and 3D AOI systems, makes programming fast, easy, and doesn't require any special programming skill or training. All you need is the Gerber and centroid CAD data. The software does the rest.
PAC-Global and CEME Now Represent Saki in the Southern US and Mexico
Apr 24, 2018 | Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that PAC Global Inc. and Competitive Edge Manufacturing Equipment (CEME) have joined the Saki America team in the Southern United States and Mexico. The companies are representing Saki's complete line of 2D and 3D automated solder paste, automated optical, and automated x-ray (SPI, AOI, and AXI) inspection and measurement systems and software and Saki's Smart manufacturing, Industry 4.0, and machine-2-machine initiatives.
Saki to Demonstrate AOI, SPI, and AXI Software and Systems at IPC APEX Booth 1127
Feb 26, 2018 | Saki Corporation will demonstrate its new 5th generation, 3D Automated Optical Inspection (AOI), 3D Solder Paste Inspection (SPI), and 3D Automated X-ray Inspection (AXI) systems and software at the IPC APEX Expo, February 27-March 1, San Diego, California, Booth 1127. In addition, Saki's 3D AOI system, based on its Quality-Driven Production (QDP) concept for true closed-loop, machine-to-machine communication, will be part of the Fuji SMART Factory Line in booth 3539.
