SMT Equipment

TR7007QI - 3D Solder Paste Inspection System

Company Information:

TRI - Test Research, Inc. USA

Test Research is the World's leading supplier of Test and Inspection Solutions in the PCBA Manufacturing Test & Inspection Industry. From 3D SPI, 3D AOI and 3D AXI Systems to MDA, ICT and Functional Test. Industry 4.0 Ready.

San Jose, California, USA


  • Phone 408-567-9898
  • Fax 408-567-9288

TRI - Test Research, Inc. USA website

Company Postings:

(23) products in the catalog

(29) news releases

TR7007QI - 3D Solder Paste Inspection System

TR7007QI - 3D Solder Paste Inspection System


TR7007QI - 3D Solder Paste Inspection System



Offered by:

TRI - Test Research, Inc. USA

TR7007QI - 3D Solder Paste Inspection System Description:

Built upon latest 3D projection technology, the TR7007QI SPI offers industry leading inspection accuracy for the most demanding applications. The inline inspection system automatically optimizes the inspection route for best performance, and TRI’s innovative SmartWarp system compensates for any board warpage during inspection. With a choice of quad/dual projector inspection, the TR7007QI is a versatile SPI solution bringing accuracy and speed to your fingertips.


  • • 100% Shadow-free Quad/Dual Digital Fringe projectors
    • Optimized Stop-and-Go Design for Maximum Accuracy
    • SmartWarp Compensation Eliminates Local PCB Deformation
    • 100% Solder Paste Defect Coverage including Low Bridges


Optical System

Imaging Method Stop-and-Go Imaging
Camera 4 Mpix or 12 Mpix (factory setting)
Imaging Resolution 6 μm, 10 μm , 15 µm (factory setting)
Lighting RGB True Color LED
3D Technology 4-way Digital Fringe Pattern
Field of View 4 Mpix@ 10 µm: 20.3 x 20.3 mm
4 Mpix@ 15 µm: 30.5 x 30.5 mm
12 Mpix@ 6 µm: 24.4 x 18.4 mm*
12 Mpix@ 10 µm: 40.8 x 30.7 mm
12 Mpix@ 15 µm: 61.2 x 46.1 mm

* 6 μm is not available for TR7007QI DL

Inspection Performance

Imaging Speed 4 Mpix: 3 FOV/sec
12 Mpix: 2 FOV/sec
12 Mpix CoaXPress: 3 FOV/sec*

Note: Inspection speed depends on PCB and inspection conditions
* With optional CoaXPress upgrade
Height Resolution @ 6 µm: 0.22 µm
@ 10/15 µm: 0.4 µm
Max. Solder Height @ 6 µm: 210/420 µm
@ 10/15 µm: 420/840 µm

Motion Table & Control

X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control Ballscrew + AC-servo controller
X-Y Axis Resolution 0.5 µm with linear scale
Z-Axis Resolution 0.5 µm with linear scale

Board Handling

Max PCB Size TR70007QI: 510 x 460 mm*
TR7007QI DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane

* 6 μm is only available for TR7007QI, the Max. PCB size is 330 x 310 mm
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Height 880 – 920 mm

* SMEMA Compatible

Inspection Functions

Defects Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
Measurement Height


WxDxH TR7007QI: 1000 x 1500 x 1650 mm
TR7007QI DL: 1000 x 1700 x 1650 mm

Note: not including signal tower, signal tower height 520 mm
Weight TR7007QI: 675 kg
TR7007QI DL: 685 kg

TR7007QI - 3D Solder Paste Inspection System was added in Feb 2018

TR7007QI - 3D Solder Paste Inspection System has been viewed 570 times

20 More Products from TRI - Test Research, Inc. USA :

Dual Lane Reflow Oven

IPC Certification Training Schedule IPC Questions and answers