EWI SonicSolder

EWI SonicSolder Description:

S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join difficult-to-wet materials like aluminum, titanium, glass, ceramics and dissimilar materials. Potential applications include tubing, electronics, medical products and structural components. In various base metal (copper, aluminum, titanium) combinations, shear strength of about 5 ksi have been obtained.