ModVIA Plasma Treatment for Printed Circuit Board Assembly

ModVIA Plasma Treatment for Printed Circuit Board Assembly Description:

VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels. The ModVIA is designed to process rigid and flexible PCB panels of various shapes and sizes for through-hole, blind via, etchback, and desmear applications

Industry-Leading Efficiency and Plasma Uniformity

PCB panels are processed in separate plasma cells to deliver high etch rates with excellent treatment uniformity. The system is self-contained and requires minimal floor space. The chassis houses the plasma chamber, control electronics, 40 kHz RF generator, pump/blower package, and automatic matching network. Maintenance access is available from either front or rear access panels.

Application Flexibility

Three electronic mass flow controllers (MFCs) are standard, enabling optimal gas control. An additional MFC is available as an option. The system accommodates many process gases to meet specific requirements (typical process gases may include Ar, O2, N2, and CF4). • The system accommodates various panel sizes and can process low-volume, high-mixture products, ideal for small to medium-sized businesses or R&D institutions.

The ModVIA incorporates the same High Flux Electrode (HFE) design found in the MaxVIA™ plasma systems. The HFE design with a temperature-controlled cooling loop delivers superior plasma treatment uniformity for PCB panel, desmear, and etchback applications.

Upgrade the system from four plasma cells to a maximum of eight as production volumes increase.

The plasma chamber is constructed of durable, high-quality aluminum.

Low CF4 gas consumption for desmear, etchback, and panel treatment applications contributes to the lowest cost of ownership in its class.