TM 230 Solderable Conductive Adhesives

TM 230 Solderable Conductive Adhesives Description:

TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. In comparison to conductive adhesives (Ag), TM230 solderable adhesives has higher and more stable electrical and thermal conductivity, are able to easily fill gaps, self-level die, and provides easy control over bonding thickness. In comparison to soldering materials, TM230 solderable adhesives eliminate the outgassing from soldering process, eliminate die skewing, shifting, and soldering bleeds. Soldered interface will be encapsulated with the curing of TM230 solderable adhesives, thus protecting soldered metal interfaces by a 3D polymer network, which can tolerate harsh environmental conditions.