SMT Equipment

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Company Information:

Manufacturer and distributor of HDI electronic materials for the printed circuit board industry

Lake Forest, California, USA


  • Phone (949) 587-3370

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Company Postings:

(1) product in the catalog

(1) technical library article

(1) news release

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material


Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material



Offered by:

Integral Technology, Inc


Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material Description:

Zeta® Cap, a glass-free laminate produced by Integral Technology has received US Patent No. 8,188,373. The patent was filed as an improved insulating layer for rigid printed circuit boards. Zeta® Cap and other related laminates have become the products to watch as these new dielectric films offer sweeping solutions as to how printed circuit boards can be constructed.The game-changing films are a family of several proprietary materials designed to help OEMs and printed circuit fabricators compete with new demands in electronics manufacturing brought on by the need for miniaturization, multiple lamination cycles, and high thermal and electrical properties.

The results from using Zeta products are nothing short of extraordinary and well worth quality assurance provided by certification. Newly patented Zeta® Cap is a copper-clad, high Tg C-stage glass-free laminate designed to eliminate pad cratering in circuit board assembly. Zeta® Lam, a related dielectric film, allows ultra-thin HDI buildup layers (down to 12 microns) with improved thickness uniformity and transmission line performance. Zeta® Bond is a proprietary glass-free B-stage bonding film capable of filling circuits and vias.

Pad cratering, which Zeta® Cap eliminates, is being recognized as a serious and evolving challenge for the PCB industry. It is a mechanically induced fracture in the resin between the copper foil and the outermost layer of fiberglass in a printed circuit board. The pad can remain connected to the component leaving a “crater” on the surface of the PCB board. It is impossible to detect without cross-sectioning a failed board.

Zeta® Cap virtually prevents pad cratering, once laminated to the surface as a cap, by acting as a shock absorber to prevent fracture formation.

The Zeta laminates are precision applied to exacting specifications. To ensure rigorous standards of installation are met, PCB fabricators must commit to a Zeta® certification program where process and equipment are brought into the standards required by these sophisticated glass-free dielectric laminates. This quality-assurance recognition indicates to OEMs, original equipment manufacturers, which fabricators are Zeta-certified.


  • Halogen Free
  • Lead free assembly compatible, very high Td (>500⁰C)
  • Compatible with multiple lamination cycles
  • Standard PCB lamination cycles may be used
  • Excellent for Laser Via formation
  • Excellent CAF resistance
  • Uses standard desmear and plating processes
  • High Modulus: 1100 kpsi
  • Low CTE: 19 ppm/⁰C
  • High copper peel strength without the need for high profile tooth: 6 -7 lbs/in.
  • Dielectric Strength: 4,900 V /mil
  • Dielectric Constant (at 1 MHz) 3.7 IPC-TM-650, Method
  • Dissipation Factor (at 1 MHz) 0.0014 IPC-TM-650, Method
  • UL-94-V0

Available Thicknesses:

Zeta™ Cap is supplied in sheet form with Electro Deposited copper foil. The options below can be provided in any combination:


  • 0.5 mils
  • 0.8 mils
  • 1.0 mil
  • 1.5 mils

Copper Foil:

  • ¼ oz
  • 1/3 oz
  • 1/2 oz


  • Zeta™ Cap dielectric is treated for bonding with a variety of materials. Zeta Bond or conventional prepreg are common choices.
  • Zeta™ Cap copper and dielectric surfaces should be kept clean and free of finger prints to ensure blister free lamination.
  • Pre lay-up bake may be required if the material was stored in a humid environment.
  • 225 to 250ºF for 30 minutes should be used to remove moisture.


Because the dielectric is fully cured, the lamination temperature and pressure should match the bonding dielectric used. Vacuum assist with a pre-lamination draw down is always preferred.

Cool down should be 5.5ºF or less per minute.


Zeta™ Cap may be stored two years from the date of manufacturing when stored in the original packaging at temperatures of 4-29°C (40-85°F) and below 50% relative humidity. It does not require refrigeration and should not be frozen. The material should be kept clean and well protected from physical damage.

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material was added in Sep 2012

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material has been viewed 1891 times

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