3D XPI 5000L - In-Line SPI System

3D XPI 5000L - In-Line SPI System Description:

Technical Innovation

• The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition)
• 4 times higher height measurement resolution than the existing Moire technology (The best accuracy and repeatability)
• 10 times wider height measurement range than the Moire technology (Enable to detect PCB warp defect and eliminate measurement error by warp)
• 3D inspection by dual projection (Eliminates shadow and specular effect)

Outstanding accuracy and repeatability with highest resolution for height measurement.

Fastest inspection speed by vibrationless On-The-Fly scan technology.

Easy and Fast Programming

• Less 10 minutes job programming time by Gerber file conversion
• Intuitive job teaching and verification with high resolution entire PCB image
• All types of fiducial marks recognizable regardless of their shape
• 1D/2D barcode recognition available as a standard
• Smart skip mark processing without additional reading time
• True volume measurement available without the effect from pad offset thickness
• Easy step stencil mask application support
• Easy template editing by flexible manual teaching function
• Part library function support

Excellent defect detectability and process improvement capability for SMT process.

Optimized SPC tool for process improvement and traceability of data.