X3 Inline X-Ray Inspection System / 3D & Transmission
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X3 Inline X-Ray Inspection System / 3D & Transmission |
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X3 Inline X-Ray Inspection System / 3D & Transmission Description:
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reconstruction software features the generation of detailed, high resolution slice images.
The X3 provides a flexible approach to inspecting solder joints on a double-sided board. Through the smart CAD Compiler, the board is segmented into a inspection strategy automated based on non-overlapping and over-lapping regions. In non-overlapping regions, 2D transmission views are taken. In overlapping areas, either the patented Slice Filter Technology (SFT) can be used to separate the overlapping components or the state-of-the-art 3D reconstruction technique called 3D-SART. 3D-SART allows for slice image sets through the entire assembly top to bottom with the highest resolution available in the market.
Key features
- Flexible inspection techniques (2D, 2.5D, 3D) based on board topology
- Off-Axis imaging (2.5D) specific for BGA devices to check for Head-In-Pillow (HIP) or Head-on-Pillow (HOP) and Barrel-Fill detection of Pin-in-Paste / THT connectors
- 3D Simultaneous Algebraic Reconstruction Technique (3D-SART) which produces industry leading slice image resolution
X-ray system features
- 130kV high resolution x-ray tube
- 2k x 2k digital flatpanel detector on x-y motion system
- 5-axis programmable motion system Algebraic reconstruction algorithm for 3D analysis (SART)
- MIPS inspection platform for off-line programming, analyzing and verification. Including a modular test algorithm library for solder joint inspection
Applications
- Double sided boards with high packing density and hidden solder joints
- Power components with heat sinks
- All standard SMD's and THT/PTH components
- Specific BGA and QFN applications
- MCM Modules
- Cooling plates/heatsink void inspection
X3 Inline X-Ray Inspection System / 3D & Transmission was added in Feb 2013
X3 Inline X-Ray Inspection System / 3D & Transmission has been viewed 1034 times
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