CL-1200 High Precision Automatic Solder Paste Printer

CL-1200 High Precision Automatic Solder Paste Printer Description:

CL-1200 is a high precision automatic solder paste printer designed for high precision screen printing or stencil printing in SMT industry.
Product Features：
Wide compatibility for PCB dimensions from 50mm x 50mm to 1200mm x 340mm and PCB thickness from 0.6mm to 6mm.
High printing resolution:
High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.03mm.
Support glue printing
Automatic control improves production efficiency, controls quality and saves production cost:
Automatic stencil positioning;
Automatic PCB alignment;
Automatic adjustment of squeegee pressure;
Automatic printing;
Automatic stencil cleaning (dry-type, wet-type);
Adopt company independently developed suspended print head and programmable automatic pressure adjustment system with pressure closed-loop feedback. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect paste forming effect.
Programmable motor controls separation speed and stroke between squeegee and stencil, to realize multi-method demold.
Multi-functional PCB fixed positioning system, for convenient and accurate PCB positioning.
Upward and downward visual positioning. 
Built-in image processing system;
Support 2D, SPC functions.  
Applicable pitches of Components
SMT Components such as resistors, capacitors, inductors, diode and triode: 0201, 0402, 0603, 0805, 1206 and other specifications.
IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball 0.2 mm.
Printing size：80mm x 50mm ~1200 mm x 340 mm;
PCB thickness: 0.6 mm ~ 6 mm
FPC thickness: less than 0.6 mm (excluding jig)
Applicable PCB Types
　　Applicable to PCB types of LED, mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, space flight and aviation, as well as production and processing of general electronics products

Specification
* The following data is measured under environment temperature of 25 ℃ and humidity of 60%.
            Items 　 　　                Parameters
Repeat Position Accuracy 　±0.015mm
Printing Accuracy　 　±0.03mm
Printing Speed/Cycle Time 　<15s (Exclude Printing & Cleaning)
Products Changeover　 　<5Min
Screen Stencil Size/Min 1100mmX300(Standard)；730mm X 300mm(Optional, pressing plate on guide rail shall be replaced)
Screen Stencil Size/Max 　1500mm X 750mm
Screen Stencil Thickness 　20mm ~ 40mm
PCB Size/Min 　80X50mm
PCB Size/Max 　1200X340mm
PCB Thickness 　0.8~6mm
PCB Warpage Ratio 　＜1%（Based on diagonal length）
Bottom of Board Size　 　15mm
Edge of Board Size　 　3mm
Transport High 　900±40mm
Transport Direction 　Left-Right; Right-Left; Left-Left; Right-Right
Transport Speed 　50-1200mm/sec programmable control
Board Location Support System 　Magnetic pin/Side support block/Flexible automatic pin（optional）
Clamping System 　Elastic side clamping/Vacuum nozzle/Extension-type Z-direction tabletting
Print head 　Programmable electric control print head (pneumatic control print head: optional)
Squeegee Speed  　10~200mm/sec
Squeegee Pressure 　0-15kg programmable control
Squeegee Angle 　60°(Standard )/55°/45°
Squeegee Type Steel squeegee (standard), rubber squeegee, and other types of squeegee customizable.
Stencil Separation Speed 　0.1~20mm/sec Programmable
Cleaning Method 　Dry-type, wet-type, vacuum-type (arbitrary combination with programmable control）
Table Adjustment Range 　X:8mm;Y:±10mm;θ:±2°
Type of Fiducial Mark　 　Standard geometry shape of fiducial point, bonding pad / stencil hole
Camera System 　Single digital camera for upward/downward vision system
Air Pressure 　4~6Kg/cm2
Air Consumption　 　About 0.07m3 /min
Control Method 　PC Control
Power Supply　 　AC:220±10%,50/60HZ 1φ 1.5KW
Machine Dimensions 　2220(W) x 1220(D) X1500(H)mm (excluding the height of indicating lighthouse)
Weight 　Approx:1500Kg
Operation Temperature 　-20°C ~ +45°C
Operation Humidity 　30%~60%