Robert Bosch LLC Automotive Electronics Division

Within the Bosch-Group, the Automotive Electronics Division develops, produces, and sells microelectronic products for automotive and non-automotive applications.


Automotive competence from a single source.

For more than 125 years, Bosch has ensured the continued viability of individual mobility: clean and economical, safe and comfortable. We are a reliable and innovative supplier and a trusted partner to the global automotive industry.

As one of the world's leading suppliers to the automotive industry, Bosch can deliver a broad spectrum of products and services, including components and systems for gasoline, diesel, hybrid and electric powertrains, systems für active and passive vehicle safety, automotive electrics and electronics, and mobile communication.

Robert Bosch LLC Automotive Electronics Division Postings

3 technical articles »

Process Control of Ionic Contamination Achieving 6-Sigma Criteria in The Assembly of Electronic Circuits

Nov 29, 2018 | P. Eckold, M. Routley, L. Henneken, G. Naisbitt, R. Fritsch, U. Welzel

Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM 650 2.3.25, was established to enable monitoring of ionic contamination within series production. The testing procedure was successfully implemented within the production of high reliability, safety critical electronic circuits, involving multiple production sites around the world. I will be shown in this paper that the test protocol is capable for meeting Six-Sigma-Criteria....

Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units

May 23, 2018 | Udo Welzel, Marco Braun, Stefan Scheller, Sven Issing, Harald Feufel

Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop....

How to Profile a PCB.

Sep 10, 2010 | M. N. Srinivasa Prasad.

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process....

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