Die Sort

Die Sort Description:

To compliment our wafer dicing and inspection processes, Syagrus Systems offers fully automated die sorting services.  Whether you require high volume production or a single wafer prototype build, Syagrus Systems has the die sorting solution for you.  We also specialize in multi die “binning” or "pizza mask" wafers.  We have over 10 years experience in processing flip chip devices and our automated die sort systems have device invert capability, so your product is ready for automated manufacturing.  Our die sorting systems can import wafer maps or work with ink dot recognition.

Die sort projects that do not lend themselves to automation are not a problem; our trained personnel along with manual die sorting systems are available to help complete your project on time. Packaging is performed per customer requirements and a variety of outputs are available including chip tray, Gel Pak® and surface mount device tape and reel.  Vacuum seal dry packaging, customized labeling,  bar coding and drop shipping services are also available.

Our Die Sorting Solutions Offer:

• 3" to 8" wafer diameter capability.
• Fast turn around time to get your product ready for final assembly.
• Pizza Mask and engineering projects.
• Inverting capabilities for bumped devices.
• Large variety of pick tips and needle configurations in stock to handle various customer die sorting requirements.
• Ink dot or wafer map input.
• Embossed SMD tape and reel, Gel Pak®, and chip tray outputs.
• Customized labeling.
• Drop shipping.