Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA
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Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA |
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Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA Description:
Sunny
Company:Beijing Chengliankaida Technology Co.,Ltd
Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China
Email: salemachines@bjclkdkj.cn
Skype :smdsupplier
Whatsapp: +86 159 01434496
Wechat: + 86 159 0143 4496
Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA
Applications:
Power Semiconductors
Hybrid Microelectronic Assembly
UHB LED´s
BGA Flip Chip
Hermetic Seals Optoelectro
Optoelectronic Package
Wafer Level Bump
MEMS
IGBT
Deparameters:
Visual Monitoring Analysis System
SiemensPLC and Industrial Personal Computer
Low Vacuum :5*10ˉ¹Pa
High Vacuum : 5*10ˉ³ Pa
Welding area : 400x 300 mm
Furnace height :100mm
Max soldering temperature : 450°C
Warm-up rate :180°C /min
Cooling rate : ≥120℃/min
Drawer bearing : 120KG
Heating platform : graphite &special treatment
Standard : vacuum chamber filling the 100% nitrogen .
Option : 100% hydrogen, nitrogen & hydrogen forming gas ,
HCOOH, ArH2 Plasma process gas
Oxygen-free soldering
Improved the wetting bahavior
Integrated or separate implementation of
cleaning processes for flux-free
Significant increase in yield by wider
process window
Rapid heating and cooling ramps , typical 3K/S
No flux residues on product level
Flux : Formic acid type ( standred )
Monitoring window : 5 sets visual window
Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA was added in Apr 2017
Reflow Oven with Integrated Vacuum Soldering KD-V43 for IGBT, BGA has been viewed 843 times
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