We are a multidisciplinary research group with 30+ PhDs and Postdocs from Engineering (Electronics / Electrical / Mechanical / Chemical / Biomedical), Science (Chemistry, Physics, Materials) and Medicine. With members from over 25 countries, BEST group is truly global. Our research revolves around the development of high-performance electronics and sensing systems on large area flexible substrates. To this end, we use high mobility materials such as silicon and graphene and cost-effective printing techniques. Where needed, we use optimized/tailored state-of-the-art micro/nanofabrication tools. Our research style is to enhance the understanding of the fundamental issues related to flexible electronics, and orient the same towards new applications. In this regard, our flexible electronic skin (eSkin) research closely connects with robotics, healthcare and wearable systems and can enable advance in several other application areas such as rollable sheets of solar cells or bendable photonics.
Bendable Electronics and Sensing Technologies (BEST) Postings
Jan 15, 2020 | Shoubhik Gupta, William Taube Navaraj, Leandro Lorenzelli, Ravinder Dahiya
Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics....