Hong Kong Polytechnic University [The]

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Hong Kong Polytechnic University [The] Postings

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Using Metal Core Printed Circuit Board (MCPCB) as a Solution for Thermal Management

Jun 19, 2020 | Winco K.C. Yung, PhD

The designs of electronic devices and systems are being continuously improved by becoming smaller in size and faster in communication speed. The potential risk associated with these specific design improvements will be an increase in power density and, consequently, a greater risk of thermal problems and failures. At the same time, the prevailing use of circuit boards integrated with power devices such as motor controllers and drivers, light-emitting diode (LED) lighting modules, power supplies, and amplifiers, and regulators for TV, etc., drive to the use of a proper thermal management system while designing these kinds of printed circuit board (PCB)....

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