Volume 1 discusses conventional (pin-in-hole) and surface mounting components and their packages before going on to discuss manual and automatic methods of assembly in considerable depth. Only then are the principles of design and layout of circuits set out. The importance of paying careful attention to thermal management of the design is stressed. The first volume finishes with a section comprised of five chapters on soldering and joining - almost a book in itself.

Volume 2 begins with a section that describes in a number of separate chapters the materials and basic methods for fabricating printed boards. The next section in this volume covers the different types of circuit board and gives their manufacturing outlines. Contamination control, effluent, environmental problems arising from electronics assembly and occupational health are the subjects of the chapters in the third section. The fourth section of this volume deals with quality assurance, testing and training and education. The volume concludes with a discussion of marketing and financial matters.

This two-volume work can arguably be called the definitive work on all aspects from the design through to the finished electronic product, at least for the next several years. The editor has collected the opinions of world experts in each field of activity and each has written a chapter (or sometimes two chapters). Never, in the history of our industry, has so much useful information been collected into one source. Each volume is written to stand-alone without reference to the other. Mr. MacLeod Ross does an excellent job with such a large under-taking. [Together the two books account for 4 1/2 inches of shelf space!!!] The production, editing, and referencing are excellent, as with all Electrochemical Publications products. The printing and cleaning chapters could be included in either volume and which ever volume didn't include those chapters would seems shorted by the exclusion. Also, it's possible that it would be helpful to have cross references of topics between the two volumes, but then again the few topics that cross reference may be few.

Authors of Volume 2 of "A Comprehensive Guide to the Design and Manufacture of Printed Board Assemblies" are:

SECTION 1: MATERIALS AND BASIC METHODS OF PB MANUFACTURE
Chapter 1: Base Materials
Part 1 - Organic Resin Based Laminates, M. Huschka, Wipperf�rth Germany
Part 2 - Ceramics and Glass Substrates, W. MacLeod Ross, Welnorth Limited

Chapter 2: Machining
Part 1 - Mainly Mechanical, J.K. Hagge and J.C. Mather, Rockwell International
Part 2 - Laser Drilling and Machining, A. Cable, Electro Scientific Industries

Chapter 3: Screen Printing
Part 1 - Stencils, R.D. Willis, Electronic Presentation Services
Part 2 - Screen Printing Inks, C.I. Wall, Electra Polymers and Chemicals
Part 3 - Printing Machines for Surface Mount, A Hobby, DEK Printing Machines

Chapter 4: Photoimaging, K.H. Dietz, Du Pont Photopolymers and Electronic Materials

Chapter 5: Etch Resists and Etching, T. Rooney, Circuit Plating Equipment Ltd.

Chapter 6: Metal Deposition, D.A. Drake, LeaRonal

Chapter 7: Next generation Printed Boards, H.T. Holden, Techlead Corporation

SECTION 2: MAJOR TYPES OF PRINTED BOARD
Chapter 8: Single- and Double-sided PBs, W. MacLeod Ross, Welnorth Limited

Chapter 9: Plated Through-hole PBs, W. MacLeod Ross, Welnorth Limited

Chapter 10: Multilayer PBs, M. Huschka, Wipperf�rth Germany

Chapter 11: Flexible Circuits, D. K. Numakura, Innovex, Inc.

Chapter 12: Polymer Thick-film PBs, S. Pienimaa, Nokia Mobile Phones

Chapter 13: Moulded Interconnection Devices, B. Barclay, Orbotech S.A.

Chapter 14: Discrete Wired PBs, B. Pledger, Pledger Technical Help

SECTION 3: CLEANING AND THE ENVIRONMENT
Chapter 15: Cleaning and Contamination Control, B.N. Ellis, Photonique S.A.

Chapter 16: Water and Effluent Treatment, B. Pledger, Pledger Technical Help

Chapter 17: Environmental Problems, , B.N. Ellis, Photonique S.A.

Chapter 18: Occupational Health, F.R. Cala and A.E. Winston, Church & Dwight Company, Inc.

SECTION 4: THE ATTAINMENT OF QUALITY
Chapter 19: Quality Assurance and Control
Part 1 - The Basics Of Quality Assurance, W. MacLeod Ross, Welnorth Limited
Part 2 - International Specifications For printed Board Materials, Boards And Their Assemblies, L.A. Pillinger, Hartwell Northants

Chapter 20: Testing the Product, W. MacLeod Ross, Welnorth Limited

Chapter 21: Training and Education
Part 1 - Developing The Electronics Manufacturing Workforce, L.J. Killian, Naval Air Warfare Center
Part 2 - Train, The key To staying On The Right Track In Other Countries, W. MacLeod Ross, Welnorth Limited

SECTION 5: MARKETS AND FINANCE
Chapter 22: Marketing PBs and Assemblies, N. Pearne, Selling Technology

Chapter 23: Product Costing, J.B. Walker, Business Consulting Services

Chapter 24: Finance, R. Bender, Cranfield School Of Management

Chapter 25: Information Technology, A.T. Kuhn, Metal Finishing Information Services, Ltd.