• PCB design, layout and fabrication
• Component fundamentals including IC's
• EMC issues
• Interconnect issues
• Reliability
• Test

Less common topics like fiber optics and MEM /MOEM are missing. Bottom line: you have to get "picky" to criticize this book.

Co-published with the IEEE Press, "The Electronic Packaging Handbook", a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. The target audience for this book is primarily engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products. Topics covered include design automation, new IC packaging technologies, materials, testing, and safety issues. The handbook consists of 16 contributed chapters written for engineers, technicians, production and testing staff, and managers.

The book ties together well with references between chapters. It is well written and edited. Each chapter includes a section of bibliographic references and suggested readings. Contents are: Fundamentals of the Design Process; Surface Mount Technology; Integrated Circuit Packages; Direct Chip Attach; Circuit Boards; EMC and Printed Circuit Board Design; Hybrid Assemblies; Interconnects; Design for Test; Adhesive and Its Application; Thermal Management; Testing; Inspection; Package/Enclosure; Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach; and Product Safety and Third-Party Certification.