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Featured Article
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Book Review
Reviewed by Dave Fish (davef  ), Pandion Electronics, Inc.
| Title:
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Wire Bond
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| Authors:
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TEEX Staff
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| Publisher:
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Texas Engineering Extension Service
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| Price:
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US$ 155.95
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The Texas Engineering Extension Service (TEEX) is a state agency that provides training, retraining, continuing education, manufacturing assistance, business assistance, and technology transfer services on an extension basis to businesses, industries and public and private agencies. TEEX, a member of the Texas A&M University System, is comprised of several divisions that provide training, products, and services.
This is a well written with good visuals, detailed, and thorough discussion of encapsulation. The primary focus of the text is plastic encapsulation of components. TEEX wrote this book to be used in conjunction with a classroom course. It is much more detailed and through than the standard handouts of copies of overhead slides that serve as the text for most courses. While book learning rarely approaches the knowledge gained in practical experience, an engineer or technically oriented operator can use this book to develop new or expand existing skills without attending the course. The book helps in understanding the encapsulation process, identifying the types and possible causes of encapsulation problems, setting-up process and encapsulation equipment parameters, and relating the effect of process and encapsulation equipment parameters on quality and reliability.
Chapters of this book are:
- The Introduction Chapter gives an overview of the need to protect circuitry from the environment and general manufacturing methods.
- The Encapsulation Methods Chapter introduces plastic, ceramic, refractory glass, and other encapsulation methods.
- The Transfer Molding Chapter presents the equipment and issues relating to plastic encapsulation.
- The Encapsulation Chapter discusses the process flow, leadframe loading, process control, mold compound transfer, curing process steps, and factors affecting proper mold release.
- The Quality Issues Chapter identifies visual and internal defects and describes methods for detecting internal defects.
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