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Featured Article
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Book Review
Reviewed by Dave Fish (davef  ), Pandion Electronics, Inc.
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This is an excellent book for manufacturing design and process engineers. It is written using a very practical, hands-on approach that provides engineers the means to increase their understanding of the principles of soldering, flux, and solder paste. It presents cutting-edge technology in a fast changing field by covering of the principles of soldering, flux, solder paste technology, area array packages, bumping technique, assembly, and the rework process.
Dr. Ning-Cheng Lee is the Vice President of Technology for Indium Corporation of America. He has hosted an On-Board Forum on SMTnet. He designed one of the better [daresay the best?] no-clean solder pastes available today.
Being a bright scientist does not always translate into the ability to be able to write a good book. In this case, it does. The author's expertise and knowledge shine through on topics that are expertly researched, written, and organized to best get his point across. Dr. Lee's book is well written and illustrated and makes the soldering process and it's troubleshooting very approachable.
His discussion of flux and its properties are unique to the soldering book genre. Of times other authors of soldering books discuss flux in the broadest of terms, almost as if they're unsure of what to say about this critical material. Here, Dr. Lee provides a very good understanding of flux chemistry and its action with the other materials of a solder connection. Also, limiting his focus on reflow soldering is refreshing. These are the things he knows and he has been not drawn into discussing topics afield from those areas.
Contents of the book are:
- Introduction to Surface Mount Technology
- Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering)
- Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology)
- Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing)
- SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack)
- SMT Problems During Reflow
- SMT Problems After Reflow
- BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping
- BGA and CSP Board Level Assembly (includes Problems Occurred at Assembly Stage and Rework)
- BGA and CSP Rework
- Flip Chip Reflow Soldering
- Optimizing Reflow Profile via Defect Mechanisms Analysis
- Lead-Free Soldering Trends of Solder Paste and Flux Technology
- How to Select Solder Pastes or Fluxes
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