SMT Express, Volume VI, Issue No. I - from SMTnet.com
APEX 2004
Preparing for Challenges and Opportunities
Finally, forecasters say the fog may be lifting. The recovery is here.
For the companies and individuals depending on the industry's fortunes, the challenge is moving from surviving to thriving. As the investment in training and technology has shrunk over the last three years,
companies must be ready with a prepared and technically up-to-date workforce. Positioned at the beginning of 2004, APEX will bring the technology, equipment and expertise that will move the industry forward.
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Dynatech Technology Enhances Level of Service Dynatech Technology, Inc., the exclusive North American distributor for Samsung Techwin SMT equipment, has enhanced its 24/7 service line with a 30-minute call-back commitment for the manufacturer's chip mounters.
BGA and QFP orientation Posted by Gilroy Misquita I would like to know if there is an International standard for BGA and QFP polarity in trays for pick and place.
Moisture Sensetive Components Posted by mrmaint I am looking for some feedback on the storage and handling of moisture sensative components.
Cleaner device for PCB Posted by rick What kind of cleaning method you recommend for PCB - double side SMD (fine pitch and BGA components) and THT elements.
BNC's automatic insertion Posted by Hiram Does anybody know something about how to place BNC's using a machine with this capability?