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Pin In Hole Intrusive Reflow Process Issues
There is growing interest in the use of pin in hole/intrusive reflow where conventional through hole components are soldered in place using solder paste during surface mount reflow. This process can eliminate hand or wave soldering especially on multi lead parts which can be time consuming to solder separately. Intrusive reflow provides joints which are equal to the strength of traditional through hole joints and the process can be more cost effective to introduce on new products. As with any new process there are changes in the process to consider and challenges to the process engineer so what are some of the issues with PIHR ?

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A short introduction to quantum computation
Civilisation has advanced as people discovered new ways of exploiting various physical resources such as materials, forces and energies. In the twentieth century information was added to the list when the invention of computers allowed complex information processing to be performed outside human brains.

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Prototype Hybrid Hard Drive promises lower power consumption, fewer hard drive malfunctions.
Samsung expects to show a prototype hard drive at WinHEC this week that includes flash memory. The design holds the promise of lower power usage and less hard drive trouble for laptop users.

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Solder.net tips
BEST Instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while.

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Forums
Lead-Free SMD repair
We produced a RoHS (lead-free) prototype order recently, and there was some components that we needed to replace on a couple of PCBA's. We found it very hard to do this even with the new solder iron.

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Problems with .45 mil ball diameter BGA
A 1:1 pad to ball diameter will cause the balls to collapse more giving you less post solder component standoff.

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Non-wetting: PTH on double-side reflow
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering problem with our connectors...

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SMT Equipment Mart
SIEMENS F4 with WPC
November,1997 for F4, 2001 for WPC. The price for the F4+WPC+20 feeder+Line computer CIF Hong Kong is 90K USD

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Panasonic MPAG3 XL
October 2000 Vintage NM-MB15A Prod. No. KCCC597 3D Recognition Camera With Coplanarity Nozzle Configuration: 3RSS,3M,3LL,3LLL

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Technical Devices NuEra Jr 16
Very clean, digital controls, v-grove fingers, 30" IR preheat, single wave, full pot.

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Job Listings
SMT line operator
Ohio, US
Need experienced operator for Contact Systems 3Z line.

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Manufacturing Process Engineer
Texas, US
Develop and set-up surface mount processes that include the full range of surface mount components, board materials and process materials. Conduct DFM reviews prior to release to production. Debug machine software programs.

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SMTNet Express
April 30, 2005
Bob Willis
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