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Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

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Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications

Flip-Chip BumpsThis paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate.

The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured.

Credit / Source: Varaprasad Calmidi, Irv Memis / Endicott Interconnect Technologies

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Forum

AOI side angle cameras

Posted by Reese

We are looking to purchase another AOI system with side angle cameras. Currently we are using a YesTech M1 system that has only a top-down camera... »»

MSD Storage - Dry Environment

Posted by Daxman

I'd really appreciate your input on some of the best ways to create a dry environment for MSD storage. Line down-time is considerable when we have to pull of and reload 20 reels of MSD parts at the beginning and end of each shift... »»

DEK Stencil image offset?

Posted by azhiker

We have a DEK 265 we will run our boards front justified with relation to the stencil, can anybody give me an offset that you are using to order your stencil when the image is in the front?... »»

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SR100- Hand Solder Training

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Six Sigma Green Belt Training - Measuring for Performance

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IPC

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info

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SMTnet Express
July 23, 2009

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