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Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure
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Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

Embedded passives account for a very large part of today's electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers and several critical defense devices. Market pressures for new products with more features, smaller size and lower cost demand smaller, compact, simpler substrates. An obvious strategy is to reduce the number of surface mounted passives by embedding them in the substrate. In addition, current interconnect technology to accommodate surface mounted passives imposes certain limits on board design which constrain the overall system speed. Embedding passives is one way to minimize the functional footprint while at the same time improving performance.

This paper discusses thin film technology based on resin coated copper capacitive (RC3) nanocomposites. In particular, we highlight recent developments on high capacitance, large area, thin film passives and their integration in System in a Package (SiP).

Credit / Source: Rabindra N. Das, Konstantinos I. Papathomas, Steven G. Rosser, Tim Antesberger, John M. Lauffer, Mark D. Poliks, Voya R. Markovich Endicott Interconnect Technologies, Inc.

Read Article...

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SMT DUAL PROCESS | Posted by Martin

Is it possible to process top and bottom side PCBA simultaneously in one SMT line. Pls suggest me whether it is possible & what should be the lead free reflow profile?... »»

Pb soldering to Pb free finishes| Posted by floydf

Does anyone out there have experience soldering with Pb solder (Sn 63 or Sn 62) to SAC 305 coated PCB lands (about 50um) or Sn-Cu plated lands (about 10um)... »»

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Does anyone has experience with Certonal FC472 as conformal coating? It looks very simple to use it. I also think that this is the only benefit to use it... »»

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