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Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects.

$BGA fractures$ Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.

Credit / Source: Karl Seelig | AIM

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productronica 2009 - 18th international trade fair for innovative electronics production

Trade Show/Exhibition | Messe München GmbH

Tue, November 10, 2009 | New Munich Trade Fair Centre, Munich, Germany

With 40,541 trade visitors from 87 countries, 1,477 exhibitors form 35 nations and 110,000m? of exhibition space in 2007, productronica is recognized as the world's leading international trade fair for innovative electronics production... »»

Southeast Design-2-Part Show

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Wed, November 18 | Carolina First Center, Greenville, SC, USA

America's largest and longest running contract manufacturing shows for the sourcing of custom parts, services and design. Regional tradeshows covering the USA provide OEMs the opportunity to meet local and national job shops ... »»

3rd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts

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Wed, December 02 | University of Maryland, College Park, MD, USA

Gather and meet with other industry professionals from all sectors of the market. Collaborate with industry experts and practitioners in interactive and mind opening workshops... »»

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SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA International | Bookstore

Next Event: South East Asia Technical Conference on Electronics Assembly Technologies - November 18

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TIM & Thermal Gap Filler Dispensing - Download our new guide for process considerations and popular configurations.

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