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Sustaining a Robust Fine Feature Printing Process

Sustaining a Robust Fine Feature Printing Process

0.4mm Pitch Pad Design with 0.20mm Pads (8mils) & 0.20mm (8mils) Spacing With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift in the technology? At what point is solder paste no longer viable? How small of a feature can be printed with solder paste, and can this process be implemented into a production environment?

Credit / Source:

George Babka | Assembléon

David Sbiroli, Chris Anglin | Indium Corporation

Richard Brooks | Christopher Associates

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SAC305 soldering to 58Bi/42Sn | Posted by Andrzej

We have an idea of running one side of PCB using 58Bi/42Sn solder to prevent glueing components on other side of PCB when board is on second run through SMT process. I wonder what issues we can meet once we try to use SAC305... »»

Bubbles on solder joint(after conformal coating curing) | Posted by TMS78

Our company is experiencing a change on the quality system. One of the things that we are discovering is the amazing variation during the reflow oven and wave solder processes... »»

Lead Free solder | Posted by jrr3434

Can anyone tell me if there is a volume difference between a pound of lead vs. lead free solder? Does lead free solder attack stainless or castiron when it's not molten?... »»

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Bottom side chip comp fallen off in wave solder...

Custom Super M.O.L.E. Thermal Protective Enclosure ?...

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Plated Through Hole Fill: Understanding Process and Assembly Requirements

FREE Online Webinar | Wed, December 16 | Sponsored by: EPTAC Corporation

Plated Through Hole Fill is always a hot topic of conversation and we continue to get questions about process issues and acceptable requirement criteria for PCB assemblies. Take a moment to listen in on what the latest acceptable criteria... »»

3rd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts

Seminar / Course | Wed, December 02 | University of Maryland, College Park, MD, USA | Sponsored by: CALCE

Gather and meet with other industry professionals from all sectors of the market. Collaborate with industry experts and practitioners in interactive and mind opening workshops... »»

INTERNEPCON JAPAN - ASIA'S LARGEST Exhibition for Electronics Manufacturing and SMT

Trade Show / Exhibition | Wed, January 20 | Sponsored by: Reed Exhibitions Japan Ltd

Asia's largest exhibition which showcases equipment, materials and technologies needed to manufacture SMT and electronic products.... »»

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2009 International Printed Circuit & Electronics Assembly Fair

Design for Testability and for Built-In Self Test Course...

Electronics West 2010...

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Responsible for designing, developing, modifying and evaluating electronic parts, components... »»

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Arizona, USA

Omron Electronics LLC, Automated Optical Inspection (AOI) division, is seeking Independent Manufacturers... »»

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Warminster, PA, USA

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Industry Associations Events

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA International | Bookstore

Next Event: Symposium on Avoiding, Detecting and Preventing Counterfeit Electronic Parts - December 2 - 3

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC Webcast Series: The Raytheon Process: PCB Fabrication and Defect Prevention Challenges - December 1 - 2

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November 25, 2009

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