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Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.

Authors:

Ronald C. Lasky, Daryl Santos, Aniket A. Bhave

Company / Organization:

Indium Corporation, Binghamton University

Read Article...

Visit the Technical Library... Submit Your Technical Paper...

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Electronic Manufacturing Exchange #128

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Forum

Solder paste transfer from jar to cartridge | Posted by nrw

I am in the process of setting up processes for a low volume SMT line for internal prototype production, where a 500g jar of solder paste would last weeks. Our distributors only seem to want to supply 500g jars... »»

Vapor Phase Reflow | Posted by Hegemon

We are evaluating Vapor Phase right now, and there is something that bothers me a bit. The machine has a preheating stage where we can bring the board, components and paste up to temp to dry the paste out before descending... »»

Sheer strength of a BGA assembly | Posted by RLM

Has anyone ever run across a specification for the sheer strength of a soldered BGA assembly. We are looking to qualify a process and would like to have a target number to shoot for.... »»

Forum

Free Seminar! Flux Considerations for Lead Free Rework

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Online Webinar | Wed, May 19 | Sponsored by: Mentor Graphics

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National Electronics Week 2010

Trade Show/Exhibition | Tue, May 18 | Sponsored by: NEW Events Ltd

The ONLY opportunity for the entire UK Electronics industry to gather at one time to see the latest technologies, share ideas, be educated and network... »»

Career Center

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QA/SMT Inspection

Spectrum Staffing, Inc.

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Mechanical Engineer (Electronic Packaging)

Barrows Search Associates, Inc.

Rochester, NY, USA

Research & Development projects involving the mechanical design aspects of electronic packaging... »»

Product Specialist

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Industry Associations Events

SMTA

SMTA Get Your Power Membership - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: SMTA Toronto Expo and Tech Forum - May 19


IPC

IPC Get Your Power Membership - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC International Conference on Reliability and Quality of Lead Free Electronics - May 20 - 21


SMTnet Express
May 12, 2010

Subscribers: 25984


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Users: 29180

Aqueous Technologies Zero-Ion g3

Go-Dove Electronic Equipment Auctions

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Solder Balls, Solder Spheres

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