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The Reliability Challenges of QFN Packaging

The Reliability Challenges of QFN Packaging

The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN.

In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.

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Authors:	Randy Kong, Cheryl Tulkoff, Craig Hillman
Company / Organization:	DfR Solutions
Presented at:	SMTA China East Conference 2010

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May 27, 2010

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