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The Reliability Challenges of QFN Packaging
SMTnet - Electronic Industry Hub

The Reliability Challenges of QFN Packaging

The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN.

In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.

Read Article...

Authors:

Randy Kong, Cheryl Tulkoff, Craig Hillman

Company / Organization:

DfR Solutions

Presented at:

SMTA China East Conference 2010

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Reflow Oven with Vacuum System | Posted by josh

Has anyone here specially the Gurus heard, used or seen a Reflow Oven with Vacuum? Is the result really good when it comes to reducing Voids? Can you share any info about this oven?... »»

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I am experiencing sporadic de-wettting issues, so I have been thinking about ways to clean fully assembled circuit boards that have open switches, contacts, etc. I also suspect that plastic bodied components have residual silicone mold... »»

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May 27, 2010

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