Product roadmaps can look like largely theoretical constructs, but assembly requirements five or ten years down the line have very practical importance. Pick & place machines have a life of seven years or more, so they should be working up to 2017 or beyond.
Assemblers looking to upgrade their production lines now need to look not only at today's equipment requirements but those of their next equipment generations. What will mobile phones, computers and other equipment look like in five years? That will determine their assembly requirements.
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield.
Whether you are using paste flux or solder paste StencilQuik� greatly simplifies your rework process while providing for a more reliable connection. This breakthrough method allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.CSPs.
Subject board fabrication calls for .05 -.125um of gold over 2 - 5 um of nickel. When doing double sided reflow using same profile, parts of the gold are tarnishing and causing test pad failures. Any ideas as to the cause?... »»
I am facing a technical challenge related to an SOIC 14lds with thermal pad on it's belly that needs to be soldered onto PCB, together with leads. It is a 50 per board, expected 80% solder load on every one... »»
PLCs (Programmable Logic Controllers) are the brains of your operation. When the PLC is not functioning properly, lines shut down, plants shutdown, even city bridges and water stations could cease to operate.... »»
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