In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package.
With respect to lead count, this packaging family is positioned between BGAs and "standard" QFN with single rows of pads. The package is characterized by the extreme design flexibility in terms of I/O count, location and shape, allowing a wide range of customization only limited by PCB layout constraints.
Are you looking for a faster, more fool-proof leadless rework method? The new BEST StencilMate&trade process is an answer to your QFN and LGA rework problems. It allows even the beginning repair technician to reliably and quickly replace leadless device packages such as QFNs or LGA packages. Alignment is simple with the edges of the stencil being "squared up" with the sides of the package thereby eliminating the need to use custom fixtures or frames...
Normally I'm using the following specification for HASL finished PCBs: "The HAL thickness should be in the range 5- 20 um (this is an average value on the whole pad). In any case, in any point of the pad, the HASL thickness must be > 1 um"... »»
PLCs (Programmable Logic Controllers) are the brains of your operation. When the PLC is not functioning properly, lines shut down, plants shutdown, even city bridges and water stations could cease to operate.... »»
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